Western Digital Technologies, Inc.

Sandisk Technologies Inc.

Everett Lyons, Iv

Daniel Joseph Linnen

Randy Gillespie

Jayavel Pachamuthu

Kirubakaran Periyannan

Narendhiran Cr

Jay Dholakia

Hoang Huynh

Dat Dinh

In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board. The apparatus also includes a first connector coupled to the printed circuit board. The first connector is configured to couple the apparatus to a computing device. The apparatus further includes a second connector coupled to the printed circuit board. The second connector is configured to couple the apparatus to a data storage device. The apparatus further includes a securement mechanism comprising a first portion and a second portion. The securement mechanism is movable about the apparatus between a first position and a second position. The first portion is configured to maintain the securement mechanism at the first position. The second portion is configured to secure the data storage device to the apparatus when the securement mechanism is in the first position.

Data storage device adaptor with securement mechanism

A fractured semiconductor die is disclosed, together with a semiconductor device including the fractured semiconductor die. During fabrication of the semiconductor dies in a wafer, the wafer may be scored in a series of parallel scribe lines through portions of each row of semiconductor dies. The scribe lines then propagate through the full thickness of the wafer to fracture off a portion of each of the semiconductor dies. It may happen that electrical traces such as bit lines in the memory cell arrays short together during the die fracture process. These electrical shorts may be cleared by running a current through each of the electrical traces.

Semiconductor device including fractured semiconductor dies

Growing community of inventors

San Jose, CA, United States of America

Everett Lyons, Iv