Lucent Technologies Inc.

At+t Corp.

Everett Joseph Canning

Ranjan Dutta

Michael Sheridan

Donald W Finley

Charles K Hoppes

The specification describes a thermocompression bonding process using anisotropic conductive film (ACF) bonding material in which the bonding pads are shaped to prevent depletion of conductive particles in the bonding region during compression. The process is useful in bump technology for interconnecting component assemblies on substrates such as glass, printed wiring boards, etc. The shaped structure can be made using photodefinable polymer strips around the bonding pads where the strips are thicker than the bonding pad. Alternative approaches to shaping one or both of the mating conductive surfaces are disclosed.

Conductive polymer film bonding technique

The specification describes an interconnection technique using compliant metal coated photodefined polymer bumps for mounting and interconnecting component assemblies on substrates such as glass, printed wiring boards, etc. The polymer chosen for the bump structure has a relatively low T.sub.g and the polymer bump is metallized in a way that substantially encapsulates the polymer.

Compliant bump technology

Aluminized optical fiber is used for transmitting electricity, as well as transmitting lightwaves. In one example, an aluminized optical fiber (17) is bonded within a photonics package in contact with a conductor (15) that interconnects it to a photonic device (12) or electronic circuit. Power is then supplied to the package by applying it to the aluminized coating (19) of the optical fiber. This avoids the need for a separate conductor extending into the photonics package for supplying electrical power. It also may significantly simplify system design since the power supply can conveniently be included a fairly remote distance from the photonics package. The aluminized optical fiber can be bonded to a metallization in the V-groove (13) that provides electrical contact simply by applying heat and pressure. This allows the aluminized fiber to be bonded without the need for any adhesives, while assuring good electrical contact for the transmission of electrical power. According to another embodiment (FIG. 6 ), the aluminized coating is used for electrical communication in an optical fiber television system.

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Trenton, NJ, United States of America

Everett Joseph Canning