Microchip Technology Inc.

Evan Kirk

Saeed Shafiyan-Rad

Christopher Alan Barnes

David Doiron

Cliff Firth

A hermetically sealed semiconductor die package having a sidewall structure having a first opening and a second opening; a lid attached to the sidewall structure to hermetically seal the first opening; a substrate attached to the sidewall structure to hermetically seal the second opening, wherein the substrate comprises first, second, and third apertures; a first button attached to the substrate to hermetically seal the first aperture; a second button attached to the substrate to hermetically seal the second aperture; and a third button attached to the substrate to hermetically seal the third aperture.

Growing community of inventors

Salisbury, MA, United States of America

Evan Kirk