Acleap Power Inc.

Evan Cosentino

Pedro Angel Fernandez

Systems and methods for thermal management using matrix coldplates are disclosed. One illustrative method may comprise directing a flow of coolant through a coldplate comprising a plurality of parallel passages by selectively connecting portions of the parallel passages to one another to create one or more regions of parallel flow, serial flow, or blocked flow in the coldplate. Selectively connecting portions of the parallel passages may comprise machining a plurality of transverse passages into the cold plate such that each of the transverse passages intersects at least some of the parallel passages. Valves may be installed to interact between the parallel and transverse passages to create and modify the different flow regions.

Systems and methods for thermal management using matrix coldplates

An apparatus for encapsulating at least one electronic component disposed on a printed circuit board may include a liquid-tight enclosure that surrounds the electronic component and that is fixed with respect to the electronic component and the circuit board, and an encapsulating material disposed inside the enclosure and encapsulating the electronic component. The enclosure may include at least one sidewall and a top. The at least one sidewall may include a rigid material, a lower edge that is proximal to the printed circuit board, an upper edge that is distal from the circuit board, and a height above the circuit board that is no more than 0.003 inches greater than a height of the electronic component above the circuit board. The top may include a solid surface disposed on the upper edge of the at least one sidewall, where the at least one sidewall and the top form the enclosure.

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Richardson, TX, United States of America

Evan Cosentino