Intel Corporation

Evan A Chenelly

Sidharth Dalmia

Thomas A Boyd

Trang Thuy Thai

Craig J Jahne

Josef Hagn

Baljit Singh

Daniel R Cox

Jonathan Jensen

Bhagyashree S Ganore

David Shia

Ralph V Miele

Eric W Buddrius

Mohanraj Prabhugoud

Bijoyraj Sahu

Andrew Larson

Eric Dwight McAfee

Christopher Wade Ackerman

Minh T Le

Mustafa H Haswarey

Rolf Laido

Carlos Alvizo Flores

Divya Swamy Bandaru

Ming-Chen Chang

The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.

Compact radio frequency (RF) communication modules with endfire and broadside antennas

A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions

Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.

Modular thermal energy management designs for data center computing

Embodiments described herein may include apparatuses, systems and/or processes to provide a cooling apparatus that includes a first heatsink, a second movable heatsink and a flexible thermal conductor physically and thermally coupled with the first and second heatsinks, where the flexible thermal conductor is to flex and remain thermally coupled with the first heatsink and the second heatsink, when the second heatsink is moved relative to the first heatsink. The first heatsink may be coupled to a heat source such as a processor that may be coupled with a PCB. Also, the movable heatsink may allow access to components, such as dual in-line memory modules (DIMMs) that are next to the first heatsink and under the movable second heatsink. Other embodiments may be described and/or claimed.

Movable heatsink utilizing flexible heat pipes

Growing community of inventors

Beaverton, OR, United States of America

Evan A Chenelly