Samsung Electronics Co., Ltd.

Eunji Yu

Yusuf Cinar

Jihong Kim

Kyungjae Kim

Kwangkyu Bang

Sunki Yun

A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.

Growing community of inventors

Hwaseong-si, South Korea

Eunji Yu