Seoul National University

Samsung Electronics Co., Ltd.

Eunho Oh

Yongtaek Hong

Byeongmoon Lee

Junghwan Byun

Sujin Jeong

Hyungsoo Yoon

Daesik Kim

A pressure sensor includes: a first substrate; a second substrate having an inner surface and a touch surface that is opposite to the inner surface, wherein the inner surface faces the first substrate with a resistance sensing space therebetween; a first electrode and a second electrode, which are arranged spaced apart from each other in the resistance sensing space; and a piezoresistive pattern arranged between the first electrode and the second electrode and disposed in the resistance sensing space, wherein the piezoresistive pattern includes a porous elastic support and a plurality of conductive carbon structures dispersed in the porous elastic support.

Pressure sensor, pressure sensor pixel array including pressure sensor, and electronic system including pressure sensor

The present disclosure provides a method of transferring an electronic element using a stamping and magnetic field alignment technology and an electronic device including an electronic element transferred using the method. In the present disclosure, a polymer may be simultaneously coated on a plurality of electronic elements using the stamping process, and the polymer may be actively coated on the electronic elements without restrictions on process parameters such as size and spacing of the electronic elements. Moreover, the self-aligned ferromagnetic particles have an anisotropic current flow through which current flows only in the aligned direction. Therefore, the current may flow only vertically between the electronic element and the electrode, and there is no electrical short circuit between a peripheral LED element and the electrode.

Electronic device and method of transferring electronic element using stamping and magnetic field alignment

Disclosed is a stretchable substrate including: a via configured to provide an electrical connection between one surface and the other surface of the stretchable substrate; and a buffer shell positioned between the via and the stretchable substrate and having a Young's modulus value that is greater than a Young's modulus value of the stretchable substrate and smaller than a Young's modulus value of the via.

Method for forming flexible substrate including via, and flexible substrate having via

A method for forming a flexible substrate having a via, according to the present embodiment, comprises the steps of: (a) arranging a mixture of conductive particles moving by means of a magnetic field, when a curable resin and the magnetic field are provided; (b) forming a material layer being cured and having flexibility; (c) arranging the conductive particles by providing a magnetic field; and (d) curing the curable resin and the material layer.

Growing community of inventors

Seoul, South Korea

Eunho Oh