Samsung Electronics Co., Ltd.

Eunho Jung

Jae Choon Kim

Jichul Kim

Jin-Kwon Bae

A semiconductor package includes a first package including a first substrate and a first semiconductor chip mounted on the first substrate and a second package facing and spaced apart from the first package. The second package includes a second substrate on which a second semiconductor chip is mounted. The semiconductor package also includes a connection structure electrically connecting the first and second packages to each other, a first temperature sensor connected to the first substrate, a second temperature sensor connected to the first semiconductor chip, and a third temperature sensor connected to the second semiconductor chip.

Growing community of inventors

Hwasung, South Korea

Eunho Jung