Samsung Electronics Co., Ltd.

Eunhee Jung

Inho Choi

Jongbo Shim

Ji Hwang Kim

Sungeun Jo

Minjin Kim

Youngdoo Jung

Kyoungsei Choi

Hyunkyu Kim

Woonbae Kim

Youngshin Kwon

Sungwoo Park

Jangwoo Lee

Kilsoo Kim

A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.

Semiconductor package including an interposer and method of fabricating the same

Semiconductor package including an in interposer and method of fabricating the same

Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.

Sensor package, method of manufacturing the same, and method of manufacturing lid structure

Disclosed is a gas sensor package. The gas sensor package comprises a package substrate, a controller on the package substrate, a plurality of gas sensors on the controller, and a lid on the package substrate and the lid comprising a hole extending between a first surface and a second surface of the lid, the first surface of the lid facing away the package substrate and the second surface of the lid facing toward the package substrate. The gas sensors sense different types of gases.

Gas sensor package

A gas sensor package includes a package substrate having a hole, the hole having an end that is opened at a first surface of the package substrate; a gas sensor disposed in the hole of the package substrate; a fixing plate disposed on the first surface of the package substrate, the fixing plate having a vent hole extending between a top surface and a bottom surface of the fixing plate, the bottom surface of the fixing plate facing toward the package substrate and the top surface of the fixing plate facing away from the package substrate, and the fixing plate overlapping the hole of the package substrate when viewed in a plan view; and a protective film attached to the fixing plate. The protective film overlaps the vent hole when viewed in a plan view.

Gas sensor package and sensing apparatus including the same

A semiconductor package includes a substrate, a semiconductor chip mounted on the substrate, an interposer chip on the semiconductor chip and including a redistribution pattern, a first pad on the interposer chip, a second pad on the interposer chip and spaced apart from the first pad, and a bonding wire electrically connected to the second pad and the first substrate. The second pad is electrically connected through the redistribution pattern to the first pad. The footprint of the interposer chip is greater than the footprint of the first semiconductor chip.

Semiconductor package having second pad electrically connected through the interposer chip to the first pad

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Hwaseong-si, South Korea

Eunhee Jung