Lg Electronics Inc.

Eungyul Lee

SeHyeon Kim

Seungmo Jung

Taegyun Park

Sanghoon Yoo

Naehyun Park

Jiwon Choi

Juhyok Kim

Hanchoon Lee

Younghwan Ko

Sangkyoung Park

Simwon Chin

A plate-type heat exchanger and a method for manufacturing same are provided. A plate-type heat exchanger includes a first plate and a second plate which have flange parts vertically adhered by an adhesive, respectively. The flange parts are formed in a stepped shape and may thus increase an area adhered to the first plate and the second plate.

Plate-type heat exchanger and a method for manufacturing same

A plate type heat exchanger includes a plate package in which a plurality of heat exchange plates is stacked to form a flow path, through which fluid flows, an end plate coupled to an outside of the plate package, and a socket connected to the plate package by passing through the end plate. The end plate includes a base which is in contact with the outside of the plate package, a socket hole which is formed through the base and into which the socket is inserted, and a ridge that protrudes outward from an edge of the socket hole of the base.

Plate type heat exchanger

A heat exchanger may include flat tubes formed of a microchannel type, and first and second fins positioned at a top and bottom of the flat tubes so as to conduct the heat of the flat tubes. The first and second fins may be respectively provided with first and second condensate water discharge fins at a top and bottom. The second condensate water discharge fins of the first fins and the first condensate water discharge fins of the second fins may come into contact, and the second condensate water discharge fins of the first fins and the first condensate water discharge fins of the second fins may be disposed in a line with respect to a vertical direction, thereby having an advantage of quickly transferring condensate water formed at the top to the bottom.

Heat exchanger

Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes in which a refrigerant flows, a heatsink fin coupled to the plurality of refrigerant tubes to heat-exchange the refrigerant with a fluid, a header disposed on at least one side of the plurality of refrigerant tubes to define a flow space of the refrigerant and a guide device disposed in the header to partition the flow space, the guide device guiding the refrigerant from the header to the refrigerant tubes. The guide device includes a movable cover part.

Provided is a heat exchanger. The heat exchanger includes a plurality of refrigerant tubes in which a refrigerant flows, a heat dissipation-fin in which the plurality of refrigerant tubes are inserted and through which the refrigerant and a fluid are heat-exchanged with each other, a header coupled to at least one side of the plurality of refrigerant tubes to define a refrigerant flow space, and a guide device disposed within the header to branch the refrigerant into a plurality of passages corresponding to the plurality of refrigerant tubes.

Provided is a heat exchanger, which includes a plurality of flat tubes in which refrigerant flows, a fin including tube couplers in which the flat tubes are inserted, wherein the refrigerant exchanges heat with a fluid through the fin, and a header coupled to at least one side portion of the flat tubes and distributing the refrigerant to the flat tubes. The fin includes a first fin coupled to a part of the flat tubes, the part of the flat tubes constituting a first row, and a second fin provided on a side portion of the first fin and coupled to another part of the flat tubes, the another part of the flat tubes constituting a second row.

A heat exchanger is provided. The heat exchanger may include a plurality of refrigerant tubes extending in a horizontal direction, at least one fin coupled to the plurality of refrigerant tubes, a vertically oriented header coupled to corresponding ends of the plurality of refrigerant tubes, the header distributing refrigerant into the plurality of refrigerant tubes, and a partition device that partitions an inner space of the header, the partition device including at least two through holes that guide refrigerant into the plurality of refrigerant tubes.

A heat pump according to the present invention comprises a plurality of the compression chambers, and compresses refrigerant with multistage, and injects vapor refrigerant into the space between the plurality of the compression chambers by using the first refrigerant injection flow path and the second refrigerant injection flow path. Performance and efficiency of the heat pump can be improved compared with non-injection, as flow rate of the refrigerant circulating the indoor heat exchanger is increased. Thus heating performance can be improved also in the extremely cold environmental condition such as the cold area by increasing the injection flow rate. Also, because the heat pump according to the present invention comprises the first refrigerant injection flow path and the second refrigerant injection flow path, refrigerant is injected twice. Thus, as the injection flow rate of the refrigerant is increased, heating capacity can be improved. Also, the difference between the suction pressure and the discharge pressure of the rotary compressor may be decreased, and thus the reliability and the performance of the rotary compressor can be improved.

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Seoul, South Korea

Eungyul Lee