Lg Chem, Ltd

Eun Yeong Kim

Kwang Joo Lee

Ji Ho Han

Mi Jang

Sang Hwan Kim

Sera Kim

Bora Yeon

Mi Seon Yoon

Da Ae Kim

Sung Chan Park

You Jin Kyung

The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a reducing agent, and a photoinitiator.

Adhesive composition for dicing tape and dicing tape including the same

The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.

Non-conductive film and manufacturing method of semiconductor laminate

The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.

Adhesive composition for dicing tape and dicing tape comprising the same

A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.

Back-grinding tape

The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0&#xb0; C. or higher, wherein the polymer resin layer has a glass transition temperature of &#x2212;30&#xb0; C. to 0&#xb0; C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.

Growing community of inventors

Daejeon, South Korea

Eun Yeong Kim