Samsung Electronics Co., Ltd.

Eun-Taeck Lee

Yun-Ho Choi

Jin-Gi Hong

Jung-Hun Seo

Jin-ho Kim

Kyung-Bum Koo

Hyun Chul Kwun

Hyun-Chul Kwun

Disclosed are chamber inserts and apparatuses using the chamber inserts. A chamber insert may include a cylindrical body portion including a top end portion and a bottom end portion, a first protruding portion extending outwardly from a first portion of the cylindrical body portion, the first portion positioned circumferentially along the cylindrical body portion and a second protruding portion extending outwardly from a second portion of the cylindrical body portion, the second portion positioned circumferentially along less than all of the cylindrical body portion. In another example, the chamber insert may include a cylindrical body portion including a top end portion and a bottom end portion, the cylindrical body portion including a slit and at least one hole, the slit and the at least one hole positioned circumferentially along the cylindrical body portion and a first protruding portion extending outwardly from a first portion of the cylindrical body portion.

Chamber inserts and apparatuses for processing a substrate

In a method of forming a layer, a titanium layer and a titanium nitride layer may be successively formed on a first wafer. By-products adhered to the inside of a chamber during the formation of the titanium nitride layer may be removed from the chamber. Processes of forming the titanium layer, forming the titanium nitride layer, and removing the by-products may be repeated relative to a second wafer.

Method of forming a layer and method of removing reaction by-products

Growing community of inventors

Suwon-si, South Korea

Eun-Taeck Lee