Samsung Electro-mechanics Co., Ltd.

Eun Tae Park

Boum Seock Kim

Seung Gyo Jeong

Tae Kyung Lee

Sung Woo Han

Beom Joon Cho

Hwa Sun Lee

Yul Kyo Chung

Yun Sung Kang

Jin Suk Son

Ran Hee Shin

Sung Sun Kim

Jeong Suong Yang

Soo Hyun Lyoo

Ki Pyo Hong

Yong Seok Choi

Jong Myeon Lee

Ho Sung Choo

Myung Whun Chang

Hyoung Ho Kim

Seung Hyun Sohn

Hyun Ju Jin

Min Ji Ko

Jeong Joo Kim

Hee Young Lee

Eun Sub Lim

Jong Chul Lee

An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonating part including a first electrode, a second electrode, and a piezoelectric layer; and a plurality of seed layers disposed on one side of the resonating part.

Acoustic resonator and method of manufacturing the same

Disclosed is a method of manufacturing a nonshrinking multilayer ceramic substrate. The method includes forming at least one conductive via and an electrode pattern in at least one of a plurality of ceramic green sheets, laminating the ceramic green sheets to form a ceramic laminate, selectively forming a shrinkage inhibiting thin film of sinter-resistant powder on a region including the conductive via and a periphery thereof in at least one of two surfaces of the ceramic laminate using aerosol deposition, disposing a shrinkage inhibiting green sheet for suppressing the shrinkage of the ceramic laminate on at least one of the two surfaces of the ceramic laminate including the shrinkage inhibiting thin film to form a non-sintered multilayer ceramic substrate, and sintering the non-sintered multilayer ceramic substrate.

Method of manufacturing non-shrinking multilayer ceramic substrate

Disclosed herein is an ultrasonic sensor including: an epoxy molding part: a piezoelectric ceramic stacked on an upper portion of the epoxy molding part; a sound absorbing material contacting sides of the piezoelectric ceramic and spaced apart from an upper portion of the piezoelectric ceramic to thereby enclose the piezoelectric ceramic and absorbing vibration; a case spaced apart from sides and a lower surface of the sound absorbing material to thereby enclose the sound absorbing material and having a shape in which a bottom surface including the epoxy molding part stacked thereon protrudes upwardly; and a molding material filled on an upper surface of the sound absorbing material and between the sides and the lower surface of the sound absorbing material and the case.

Ultrasonic sensor

There are provided an electronic paper display device and a method for manufacturing the same. The electronic paper display device includes a first substrate having a first electrode made of transparent material and formed thereon; a second substrate arranged opposite to the first substrate with a predetermined space and having a second electrode formed thereon; a display element layer formed between the first substrate and the second substrate and having a plurality of display elements arranged thereon, the display elements having optical characteristics changed by voltage applied to the first and second electrodes; and vibration parts formed on the first substrate or the second substrate and configured to apply vibrations to the display elements by the voltage applied to the first and second electrodes.

Electronic paper display device and method for manufacturing the same

There is provided a haptic feedback device and an electronic device having the same. The haptic feedback device includes a display panel receiving contact pressure applied thereto; an actuator generating vibrations so as to give different types of haptic feedback according to a change in the contact pressure applied to the display panel; a support plate supporting the actuator; a bonding portion provided between an end portion of the actuator in a lengthwise direction thereof and the support plate so as to fix the actuator to the support plate; and a vibration space expanding portion formed to be recessed in a portion of the support plate corresponding to the actuator.

Haptic feedback device and electronic device having the same

Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBiO-bBO-cSiO-dBaO-eTiO, where a+b+c+d+e=100, and a, b, c, d, and e are 40&#x2266;a&#x2266;89, 10&#x2266;b&#x2266;50, 1&#x2266;c&#x2266;20, 0&#x2266;d&#x2266;10, and 0&#x2266;e&#x2266;10, respectively.

Glass composition, dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same

Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of fired ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets.

Method of manufacturing multilayer ceramic substrate

The invention relates to a high-dielectric constant metal/ceramic/polymer composite material and a method for producing an embedded capacitor. As ceramic particles having a relatively small size are bound to the surface of metal particles having a relatively large size by mixing, the occurrence of percolation can be prevented without coating the metal particles, and at the same time, the capacitance of an embedded capacitor can be increased. In addition, a process for coating the surface of the metal particles can be omitted, thus contributing to the simplification of the overall preparation procedure.

High-dielectric constant metal-ceramic-polymer composite material and method for producing embedded capacitor using the same

Disclosed herein is a polymer-ceramic dielectric composition. The dielectric composition comprises a polymer and a ceramic dispersed in the polymer wherein the ceramic is composed of a material having a perovskite structure represented by ABOand a metal oxide dopant and has an electrically charged surface. According to the dielectric composition, the surface of the ceramic is electrically charged to induce space-charge polarization (or interfacial polarization) at the polymer/ceramic interface, resulting in an increase in dielectric constant. Since the dielectric composition has a high dielectric constant particularly in a low-frequency range, it can be suitably used to produce decoupling capacitors.

Polymer-ceramic dielectric composition, embedded capacitor using the dielectric composition and printed circuit board having the capacitor embedded therein

The present invention relates to a method of fabricating a printed circuit board having embedded multi-layer passive devices, and particularly, to a method of fabricating a printed circuit board having an embedded multi-layer capacitor, in which a capacitor is formed to have multiple layers in the PCB to increase capacitance.

Growing community of inventors

Gyunggi-do, South Korea

Eun Tae Park