Lg Electronics Inc.

Samsung Electro-mechanics Co., Ltd.

Hanall Biopharma Co., Ltd.

Optis Cellular Technology, LLC

Korea University Research and Business Foundation

Hk Inno.n Corporation

Samsung Electronics Co., Ltd.

Cj Healthcare Corporation

Wild Guard Ltd.

Sungkyunkwan University

Sfc Co., Ltd.

Lg Elecronics Inc.

Dayou Smart Aluminum Co, Ltd.

Microsoft Technology Licensing, LLC

Eun Sun Kim

Joon Kui Ahn

Ki Jun Kim

Dong Youn Seo

Hak Seong Kim

Young Woo Yun

Suk Hyon Yoon

Bong Hoe Kim

Yong Ho Seok

Dae Won Lee

Yong Kim

Jong Hyun Park

Jung Hoon Lee

Sung Duk Choi

Dong Wook Roh

Han Byul Seo

Byoung Hoon Kim

Jin Uk Lee

Sung Wuk Kim

Seung Kook Park

Jae Kap Jeong

Yeon Jung Song

Ill Soo Sohn

Kwang Do Choi

Young Hun You

Hyang Sun You

Byeong Geol Cheon

Sung Ah Lee

Chi Won Hwang

In Jae Jung

Hoon Jai Chun

Hyea Kyung Ahn

Hae-Young Yong

Dongok Shin

Jae Hong Kweon

Min Sun Kim

Ha Na Kim

Sung Soo Jun

Dong Hyun Ko

Hyuk Woo Lee

Min Kyoung Lee

Song Young Kim

Jae Sun Kim

Tae Hyoung Yoo

Yong Wan Ji

Hyung Chul Yoo

Hongbo Si

Byeong Woo Kang

Byoung-Hoon Kim

Yingzhe Li

Seong Hoon Jeong

Sangik Cho

Chi Seong Kim

Hyuk Soon Choi

Ji Hyun Lee

Bong-Rae Cho

Suh Wook Kim

Seung Han Kim

Ji Yun Lee

Chang Su Lim

Chae Young Ryu

SeungPyeong Heo

Yu Jin Noh

Jae Min Lee

Won Seok Lee

Hyung Tae Kim

Young Ju Kim

Young Woo Park

Yun Jung Yi

Sang Yun Lee

Ji Yeon Kim

Young Hee Lee

Jong Heon Kim

Byung Joo Kim

Eun Soo Lee

Jong Eun Park

Kyung Dae Park

Tae Won Um

Hyung Min Yook

Hak-seong Kim

Seung Chan Heo

Young Joon Park

Seog Beom Song

Young Ook Cho

Bora Keum

Mi Na Kwag

Jung Hwa Hong

Bo Ra Keum

Guh Hwan Lim

Jin Oh Park

Jeong Haing Heo

Dong Eun Kang

Hung Keun Lee

Sajal Kumar Das

Sun Young Yang

Yu Mi Kim

Jun Kui Ahn

Wha Sook Jeon

Kang Pyo So

A printed circuit board includes: a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; and a bridge embedded in the wiring substrate and having a plurality of connection pads thereon. An uppermost wiring layer of the plurality of wiring layers includes a plurality of bump pads connected to the plurality of connection pads, and a pitch between at least two adjacent connection pads of the plurality of connection pads is larger than a pitch between at least two adjacent ones of the plurality of bump pads.

Printed circuit board

A printed circuit board includes a first insulating layer, a first conductor-pattern layer disposed on one surface of the first insulating layer, a first recess formed in the other surface of the first insulating layer opposing one surface of the first insulating layer, a second conductor-pattern layer disposed in the first recess, and a first metal post penetrating the first insulating layer, connecting the first and second conductor-pattern layers to each other, and having one end exposed to a bottom surface of the first recess, wherein the second conductor-pattern layer includes a seed layer disposed on at least a portion of each of a surface of one end of the first metal post exposed to the bottom surface of the first recess and an internal surface of the first recess including the bottom surface of the first recess, and a plating layer disposed on the seed layer to fill at least a portion of the first recess.

The present invention relates to a pidolate salt and malate salt of a compound represented by a formula 1 with an excellent liquid-phase stability, solid-phase stability, water solubility, precipitation stability and hygroscopicity all together as a compound for preventing and treating diseases mediated by an acid pump antagonistic activity, as well as a method for preparing the same.

Acid addition salts of benzimidazole derivative

A printed circuit board includes a first board including a plurality of first insulating layers and a plurality of first wiring layers disposed between the plurality of first insulating layers, respectively; and a second board disposed on one surface of the first board and including a plurality of second insulating layers and a plurality of second wiring layers disposed on or between the plurality of second insulating layers, respectively. At least one of the plurality of first insulating layers has a thickness less than a thickness of at least one of the plurality of second insulating layers. The first board further includes a through-via penetrating each of the plurality of first insulating layers and connected to one of the plurality of second wiring layers.

A printed circuit board includes a first insulating layer having a through cavity and containing an insulating material. A length between one side surface and the other side surface opposite to the one side surface of the through cavity is greater than a thickness of the first insulating layer, and the first insulating layer includes a recess located in each of an upper edge and a lower edge of the one side surface of the through cavity.

Printed circuit board and method for manufacturing the same

An electrical stimulation device according to an embodiment includes: an elongated element having working channels; a plurality of electrical stimulators each including a longitudinal member extending along the longitudinal direction of the working channel, and a tip which is installed at the distal end of the longitudinal member and configured to apply electrical stimulation to a subject; and a control unit that independently controls the plurality of electrical stimulators to vary the range of electric stimulation applied to the subject.

Electrical stimulation device

A printed circuit board includes: a first insulating layer having a recess portion in one surface of the first insulating layer; a first circuit pattern embedded in the first insulating layer and being in contact with a lower surface of the recess portion; a second insulating layer disposed on the one surface of the first insulating layer to be disposed in at least a portion of the recess portion; and a via penetrating through at least a portion of the second insulating layer, disposed in the recess portion, and connected to the first circuit pattern.

A printed circuit board includes: an insulating member; a first wiring layer disposed in the insulating member, and including first and second pattern layers spaced apart from each other based on a thickness direction of the printed circuit board; and a second wiring layer disposed in the insulating member, and spaced apart from the first pattern layer over the first pattern layer based on the thickness direction. Based on the thickness direction, an insulation distance between the first pattern layer and the second pattern layer is smaller than an insulation distance between the first pattern layer and the second wiring layer, and each of the first and second pattern layers is thinner than the second wiring layer.

A printed circuit board includes: a first insulating layer; a via pad including a first layer embedded in the first insulating layer and a second layer disposed on the first layer; and a first via layer disposed on the via pad, wherein the second layer has a width decreasing in a direction away from the first layer in a stacking direction of the first and second layers.

A method of a user equipment (UE) in a wireless communication system supporting a shared spectrum channel access is provided. The method comprises: receiving, from a base station (BS), a set of higher layer parameters including a subcarrier spacing of a physical random access channel (PRACH) preamble, a logical root index (i) for the PRACH preamble, and an index (zeroCorrelationZoneConfg); determining a sequence length (L) for the PRACH preamble based on the subcarrier spacing of the PRACH preamble; determining a physical root index (i) for the PRACH preamble based on the logical root index (i); determining a cyclic shift (N) for the PRACH preamble based on the index (zeroCorrelationZoneConfg); generating the PRACH preamble based on the determined sequence length L, the determined physical root index i, and the determined cyclic shift N; and transmitting, to the base station (BS) over the shared spectrum channel, the PRACH preamble.

Method and apparatus for wideband PRACH configuration for NR unlicensed

A preparation method according to the present invention makes it possible to industrially produce large amounts of highly pure optically active tert-butyl 3-methyl-4-oxopiperidine-1-carboxylate in high yield by use of commercially available reagents and solvents. In addition, the use of novel intermediates according to the present invention makes it possible to produce highly pure optically active tert-butyl 3-methyl-4-oxopiperidine-1-carboxylate in high yield.

Intermediates for optically active piperidine derivatives and preparation methods thereof

A printed circuit board includes a first insulating layer; a first wiring layer disposed on one surface of the first insulating layer and including a pad; a second insulating layer disposed on the one surface of the first insulating layer and covering the first wiring layer; a second wiring layer disposed on one surface of the second insulating layer and including a metal pattern; a third insulating layer disposed on the one surface of the second insulating layer and covering the second wiring layer; and a cavity extending through each of the second and third insulating layers, and having a bottom surface and a sidewall respectively exposing the pad of the first wiring layer and the metal pattern of the second wiring layer. The cavity includes a non-through groove in the one surface of the first insulating layer.

A printed circuit board includes a first insulating layer; a protective filler layer disposed on one surface of the first insulating layer; a first wiring layer disposed on the one surface of the first insulating layer and having a pad protruding with respect to the protective filler layer; a first via passing through the first insulating layer and contacting the pad; and a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively.

The present disclosure relates to an isolated anti-FcRn antibody, which is an antibody binding to FcRn (stands for neonatal Fc receptor, also called FcRP, FcRB or Brambell receptor) that is a receptor with a high affinity for IgG or a fragment thereof, a method of preparing thereof, a composition for treating autoimmune disease, which comprises the antibody, and a method of treating and diagnosing autoimmune diseases using the antibody. The FcRn-specific antibody according to the present disclosure binds to FcRn non-competitively with IgG to reduce serum pathogenic auto-antibody levels, and thus can be used for the treatment of autoimmune diseases.

Antibody binding to FCRN for treating autoimmune diseases

Growing community of inventors

Anyang-si, South Korea

Eun Sun Kim