Dow Silicones Corporation

Dow Toray Co., Ltd.

Dow Global Technolgoies LLC

Eun Sil Jang

Marc-Andre Courtemanche

Yanhu Wei

Jon Vierling Degroot, Jr

Tadashi Okawa

Haruhiko Furukawa

Takuya Ogawa

Bizhong Zhu

Tomohiro Iimura

Eric Jude Joffre

Eric E Joffre

Jon V Degroot

A composition contains a mixture of silyl hydride, a silanol and/or a silyl ether, and a Bridged Frustrated Lewis Pair.

Bridged frustrated Lewis pairs as thermal trigger for reactions between Si—H and Si—OR

Provided is a silicone adhesive composition and an application thereof, that has a viscosity that enables coating even with a small amount of solvent content, has excellent curability due to hydrosilylation reaction, cures, has sufficient adhesive strength for practical use, and has excellent mechanical strength and elongation of the adhesive layer after curing, and can form a pressure-sensitive adhesive layer having sufficient adhesive strength for practical use. The adhesive composition comprises: (A) a chain-like organopolysiloxane having at least two aliphatic unsaturated carbon-carbon bond-containing groups only at the terminals of the molecular chain; (B) a straight-chain organohydrogenpolysiloxane having silicon-bonded hydrogen atoms only at both terminals of the molecular chain; (C) a resinous organopolysiloxane; and (D) an organopolysiloxane having at least one or more aliphatic unsaturated carbon-carbon bond-containing groups at locations other than the ends of the molecular chain, and having three or more aliphatic unsaturated carbon-carbon bond groups in the molecule.

Silicone adhesive composition and use thereof

A composition contains an alpha-beta unsaturated ester, a silyl hydride, and a Bridged Frustrated Lewis Pair.

Bridged frustrated Lewis pairs as thermal trigger for reactions between Si—H and alpha-beta unsaturated esters

A composition contains a mixture of silyl hydride, a siloxane and a Bridged Frustrated Lewis Pair and can be thermally triggered to cure.

Bridged frustrated lewis pairs as thermal trigger for reactions between Si—H and Si—O—Si

An organosilicon compound having not more than 200 silicon atoms per molecule is provided. The organosilicon compound is represented by the following average compositional formula (I): YRSiOwherein Ris an alkyl group having 1 to 12 carbon atoms, alkenyl group having 2 to 12 carbon atoms, aryl group having 6 to 20 carbon atoms, alkoxy group having 1 to 6 carbon atoms, or a hydroxyl group; Y is a specific acylphosphinate residue; and subscripts a and b are numbers satisfying the following conditions: 0<a≤2, 0<b≤3, and a≤b. The organosilicon compound is compatible with organopolysiloxanes and is useful as a photo-initiator for various types of photo-curable compositions.

Organosilicon compound, method for producing thereof, and use thereof

A composition contains a mixture of silyl hydride, epoxide and a Bridged Frustrated Lewis Pair.

Bridged frustrated Lewis pairs as thermal trigger for reactions between Si-H and epoxide

A composition for forming a silicone elastomer is disclosed. The composition comprises: A) a linear organopolysiloxane having at least two silicon-bonded ethylenically unsaturated groups per molecule; B) a linear organohydrogensiloxane having at least two silicon-bonded hydrogen atoms per molecule; C) at least one cross-linker; and D) a hydrosilylation catalyst. The cross-linker C) is selected from the group consisting of: C1) an organopolysiloxane having at least three silicon-bonded ethylenically unsaturated groups per molecule; and C2) an organopolysiloxane having at least three silicon-bonded hydrogen atoms per molecule. At least one of the silicon-bonded ethylenically unsaturated groups of component C1) has a lower reactivity relative to the silicon-bonded ethylenically unsaturated groups of component A). Moreover, at least one of the silicon-bonded hydrogen atoms of component C2) has a lower reactivity relative to the silicon-bonded hydrogen atoms of component B). Methods of forming three-dimensional (3D) articles utilizing the compositions are also disclosed.

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Midland, MI, United States of America

Eun Sil Jang