Samsung Electronics Co., Ltd.

Eun Seok Hong

Won Seob Kim

Gyoung Hwan Park

Sung Jin Kim

Jin Young Park

Jin Yong Jang

Jin Kyu Choi

Ki Yeon Park

Hyun Sik Yun

Gil Yoon Kim

Hark Byeong Park

Seong Ho Yoon

Seung Jin Yang

Woo Sung Jang

Shin Ho Kim

Dong Ho Yu

Jae Ryong Han

Kyu Hyuck Kwak

Yong Hoi Kwon

Young Kun Kwon

Duck Jin Kim

Chan Gi Park

Chul Soon Hwang

Eak Hwan Song

Chun Mok Chung

A printed circuit board according to various embodiments of the disclosure includes a plurality of layers in which at least one opening is formed and at least one antenna included in at least one layer among the plurality of layers, and the at least one opening is located within a specified distance from the at least one antenna and is formed through at least one of the plurality of layers.

Printed circuit board, and apparatus for measuring quality of printed circuit board

An electronic device is provided. The electronic device includes a communication module, a first processor and a second processor, and a plurality of filters. The first processor identifies a frequency band corresponding to the network, and the second processor receives information on the frequency band from the first processor and determines a filter to be used among the plurality of filters based on the information.

Electronic device and method for controlling radio frequency interference

Disclosed is a connector that interrupts electromagnetic waves and includes a terminal part, an inner shell surrounding the terminal part and having a plug form that is inserted into the connector from outside of the connector, and an outer shell surrounding at least a portion of the inner shell.

Connector and electronic device including the same

An electronic device is provided. The electronic device includes a memory configured to store at least one instruction associated with a universal serial bus (USB) communication function or a wireless communication function operation, and at least one processor connected to the memory and configured to execute the at least one instruction stored in the memory. When a request for execution of the wireless communication function is received during execution of the USB communication function, the at least one instruction executed by the processor is configured to deactivate the execution of USB communication function in corresponding to a type of the USB communication function.

Electronic device operating method and electronic device for supporting the same

A wireless charging pad, a wireless charging device including the wireless charging pad, and an electronic device using the wireless charging device are provided. The wireless charging pad includes a pad case, a transmit (TX) coil disposed on an inner side of the pad case, and wound to form a surface for which a central portion of the TX coil is empty, a TX coil substrate on which the TX coil is disposed, a pad magnetic substance disposed on the TX coil substrate at a distance from the central portion of the TX coil, and a supporting structure supporting the TX coil substrate, the supporting structure movable relative to the pad case.

Wireless charging pad, wireless charging device, and electronic device using the same

An electronic device includes an audio module, a Bluetooth module, and a processor. If an audio output mode is a mode in which the audio module and the Bluetooth module are activated at the same time and if playback of audio data is requested while the Bluetooth module is connected with an external device, the processor is configured to determine whether the audio data is call data or media data, to send the audio data through a first path if the audio data is the call data, and to send the audio data through a second path if the audio data is the media data.

Electronic device and audio ouputting method thereof

A cache and a method for performing data copying are provided. The cache includes a copy logic and be connected to a processor through a first bus and to a memory controller through a second bus, which is different from the first bus. Moreover, the copy logic may perform data copying through the second bus based on a data copy command received from the processor.

Method and apparatus for copying data using cache

A connector mounted on a printed circuit board (PCB) is provided. The connector includes a mid-plate electrically connected to a ground terminal of the PCB and including a metallic material, a plurality of upper terminals situated on the mid-plate, a plurality of lower terminals situated under the mid-plate, a first insulation member situated on the mid-plate while supporting the upper terminals, a second insulation member situated under the mid-plate while supporting the lower terminals, and a pad electrically connected to the mid-plate and shielding an electromagnetic wave.

Connector of an electronic device

A connecting device is provided. The connecting device includes a first connector having a first pin row, a second connector having a second pin row, a data line connecting a data pin of the first pin row and a data pin of the second pin row, and a recognition line connecting a power pin of the first pin row and a recognition pin of the second pin row through a physical element.

Connecting device and method for recognizing device

Disclosed herein are a passive equalizer and a high-speed digital signal transmission system, including first and second impedances connected in series to a first transfer line, third and fourth impedances connected in series to a second transfer line, a first inductor connected in parallel between the first impedance and the second impedance, a second inductor connected in parallel between the third impedance and the fourth impedance, and a resistor connected in series between the first inductor and the second inductor.

Passive equalizer and high-speed digital signal transmission system using the same

A multi layer electromagnetic wave absorber is provided. The absorber includes a surface layer comprising at least one of a dielectric lossy mixture and a magnetic lossy mixture, an absorption layer, laminated on a rear side of the surface layer, comprising: a dielectric lossy mixture having a higher loss than the dielectric lossy mixture for the surface layer, and a magnetic lossy mixture having a higher loss than the magnetic lossy mixture for the surface layer, and a boundary layer, laminated on a rear side of the absorption layer, comprising a conductive material.

Growing community of inventors

Suwon-si, South Korea

Eun Seok Hong