Gigalane Co., Ltd.

Hanmi Pharm. Co., Ltd.

Spectrum Pharmaceuticals, Inc.

Samsung Electronics Co., Ltd.

Eun Jung Kim

Hee Seok Jung

Kyung Hun Jung

Hwa Yoon Song

Jin Uk Lee

Chang Hyun Yang

Sun Hwa Cha

Jae Hyuk Choi

Sang Min Seo

Gajanan Bhat

Shanta Chawla

Gyu Hyan Lee

Yu Yon Kim

Hyesun Han

Dae Jin Kim

Jong-Soo Lee

Ji Young Song

Su Yeon Park

Jong Min Lee

Hye Won Kim

Sung Yeon Ryu

Provided are a protein conjugate in which a physiologically active polypeptide is linked to a biocompatible material via a non-peptidyl polymer-coupled fatty acid derivative compound serving as a linker, exhibiting an increased duration of physiological activity compared to natural forms and a preparation method therefor. Since an increase in serum half-life of the physiologically active polypeptide of the protein conjugate, in which the biocompatible material, the non-peptidyl polymer-coupled fatty acid derivative compound, and the physiologically active polypeptide are linked, is proved, the protein conjugate may be widely used in the field of protein drugs.

Protein complex comprising non-peptidyl polymer-coupled fatty acid derivative compound as linker and preparation method therefor

This disclosure provides a method of preventing, alleviating or treating a condition (i.e., neutropenia) in a subject in need thereof, the condition characterized by compromised white blood cell production in the subject. The method includes administering to the subject a therapeutically effective amount of a protein complex on the same day as a chemotherapy regimen, wherein the protein complex is a modified human granulocyte-colony stimulating factor (hG-CSF) covalently linked to an immunoglobulin Fc region via a non-peptidyl polymer. The non-peptidyl polymer is site-specifically linked to an N-terminus of the immunoglobulin Fc region, and the modified hG-CSF comprises substitutions in at least one of Cys17 and Pro65.

Methods of treating neutorpenia using G-CSF protein complex

A semiconductor device includes a plurality of first conductive patterns extending parallel in a first direction on a substrate, a plurality of second conductive patterns extending parallel in a second direction crossing the first direction on the substrate, a plurality of buried contacts connected to the substrate between the plurality of first conductive patterns and between the plurality of second conductive patterns, and a landing pad connected to each of the buried contacts on the plurality of buried contacts. The landing pad includes a first side surface extending in the first direction in plan view and a second side surface extending in a third direction in plan view. The third direction is different from the first direction and the second direction in plan view.

Semiconductor memory device and method for fabricating the same

The disclosed invention relates to a method of manufacturing a housing-integrated board mating connector, the method including: preparing a housing of an electrical device, the housing having a housing insertion hole formed therein and a part or the entirety of the housing being made of a conductive metal material; inserting a cylindrical ground gasket into the housing insertion hole; preparing a dielectric part and signal terminal part assembly in which a dielectric part surrounds a signal terminal part; and inserting the dielectric part and signal terminal part assembly into an inner circumferential surface of the ground gasket.

Housing-integrated board mating connector and method of manufacturing same

Connector for signal transmission

Signal transmission connector

Growing community of inventors

Hwaseong-si, South Korea

Eun Jung Kim