Cheil Industries Inc.

Lotte Advanced Materials Co., Ltd.

Eun Ju Lee

Sang Kyun Im

So Young Kwon

Suk Min Jun

Ki Yon Lee

Sung Chul Choi

Young Sub Jin

Jin Kyu Kim

Joon Sung Kim

Shin Hyo Bae

Seung Youb Bang

Kyoung Kyun Park

The continuous solid-state polymerization device of the present invention comprises: a feeder for continuously introducing a prepolymer; a horizontal reactor which is connected via a first connecting part to the feeder and receives the prepolymer from the feeder so as to subject same to solid-state polymerization, wherein the reactor itself is rotated; a stirring device which comprises a stirring shaft rotating inside the horizontal reactor, in the direction opposite to that of the rotational axis of the horizontal reactor, and comprises stirring blades joined vertically to the stirring shaft; and a chamber which is connected via a second connecting part to the horizontal reactor and, once the solid-state polymerization has been completed, receives the resulting polymer discharged from the horizontal reactor, and, here, the feeder, the horizontal reactor and the chamber are in a vacuum state. The continuous solid-state polymerization device prevents the formation of prepolymer stagnation zones, and allows solid-state polymerization to take place continuously in the vacuum state without any inert gas.

Continuous solid-state polymerisation device and method

The polyamide resin of the present invention is a polyamide resin containing an amine group and a carboxyl group, wherein the amine group concentration is about 200 to 300 &#x3bc;eq/g and two to six times as high as the carboxyl group concentration. The polyamide resin has excellent long-thermal stability.

Polyamide resin, preparation method therefor, and molded product including same

A polyamide ester resin is a polymer of: a dicarboxylic acid; a diamine; and a linear aliphatic diol, wherein, based on a total amount of the diamine and the linear aliphatic diol, the diamine is present in an amount of about 75 mol % to about 99 mol % and the linear aliphatic diol is present in an amount of about 1 mol % to about 25 mol %, and wherein the polyamide ester resin has a melting point (Tm) from about 280&#xb0; C. to about 320&#xb0; C. and a crystallization temperature (Tc) from about 260&#xb0; C. to about 290&#xb0; C. The polyamide ester resin can exhibit excellent heat resistance, discoloration resistance, and moldability.

Polyamide ester resin, method of preparing the same, and molded article including the same

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Uiwang-si, South Korea

Eun Ju Lee