Samsung Electronics Co., Ltd.

Eun Jeong Kang

Young Keun Lee

Se Ki Park

Gi Wook Kim

Moon Hwan Chang

Gi Cherl Kim

Seock Hwan Kang

Eun Chae Jeon

The present invention relates to a method for manufacturing a light emitting diode (LED) chip for a chip on board and a method for manufacturing an LED light source module in a chip on board fashion. The method of the present invention includes forming a plurality of LED chips on a wafer, molding a region of each LED chip, cutting the wafer into each LED chip, and testing each LED chip for operating characteristics.

Method for manufacturing light emitting diode chip and light emitting diode light source module

The present invention provides a side emitting lens that may reduce optical loss and improve light emitting ratios, and a backlight unit and liquid crystal display including the side emitting lens. The side emitting lens may have a substantially dome-shaped body. The body includes a base part on which external light is incident, a refracting part to refract incident light and emit the light from side surfaces, and a reflecting part. The reflecting part is in the shape of a conical recess at a central portion of the refracting part to fully reflect the incident light toward one of the refracting part and the base part and the reflecting part comprises two or more reflecting surfaces. Each of the two or more reflecting surfaces is a curved surface.

Side emitting lens, and backlight unit and liquid crystal display including the same

Growing community of inventors

Cheonan-si, South Korea

Eun Jeong Kang