Samsung Electro-mechanics Co., Ltd.

Eun Hyuk Chae

Byoung Hwa Lee

Min Cheol Park

Doo Young Kim

Hae Suk Chung

Hai Joon Lee

Jin Man Jung

Hae Sock Chung

Kang Heon Hur

Jin Woo Lee

Dae Bok Oh

Kyu Ree Kim

Eun Hye Choi

Bae Gen Lee

Jong Ho Lee

Jae Yeol Choi

Jin Sung Kim

Hyun Hee Gu

Hye Seong Kim

Young Don Choi

Deok Seok Oh

Jung Hyun Jeon

There is provided a multilayer ceramic electronic component, including: a ceramic body having external electrodes; and internal electrodes disposed between ceramic layers within the ceramic body, the ceramic body having a width smaller than a length thereof and the number of laminated internal electrodes being 250 or more, wherein when the thickness of the ceramic layer is denoted by Tand the thickness of the internal electrode is denoted by T, 0.5&#x2264;T/T&#x2264;2.0, and when the thickness of a central portion of the ceramic body is denoted by Tand the thickness of each of side portions of the ceramic body is denoted by T, 0.9&#x2264;T/T&#x2264;0.97, and thus, a multilayer ceramic electronic component having low equivalent series inductance (ESL) may be obtained.

Multilayer ceramic electronic component and method of manufacturing the same

A multilayer ceramic electronic component includes: a ceramic body including: an active part with dielectric layers interposed with a plurality of first and second internal electrodes; an upper cover part above the active part; a lower cover part below the active part and having a thickness greater than that of the upper cover part; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively, wherein the first and second external electrodes are disposed on respective end surfaces of the ceramic body in a length direction and on a lower surface of the ceramic body in a thickness direction and are not disposed on an upper surface of the ceramic body in the thickness direction.

Multilayer ceramic electronic component and board having the same

An embedded multilayer ceramic electronic component includes a ceramic body including a dielectric layer and having first and second main surfaces, first and second side surfaces, and first and second end surfaces, first and second internal electrodes, and first and second external electrodes, wherein the first external electrode includes a first base electrode electrically connected to the first internal electrode, a first intermediate layer, and a first terminal electrode, the second external electrode includes a second base electrode electrically connected to the second internal electrode, a second intermediate layer, and a second terminal electrode, the first and second base electrodes include a first conductive metal and glass, and the first and second terminal electrodes are formed of a second conductive metal.

Embedded multilayer ceramic electronic component and printed circuit board having the same

There are provided multilayer ceramic capacitor, a manufacturing method therefor, a circuit board having a multilayer ceramic capacitor embedded therein, and a polishing device for a multilayer ceramic capacitor.

Multilayer ceramic capacitor, manufacturing method therefor, circuit board having multilayer ceramic capacitor embedded therein, and polishing device for multilayer ceramic capacitor

There is provided an embedded multilayer ceramic electronic component including: a ceramic body including dielectric layers, having first and second lateral surfaces opposing one another, and having a thickness equal to or less than 250 &#x3bc;m; a first internal electrode and a second internal electrode disposed to face one another with the dielectric layer interposed therebetween; a first external electrode formed on the first lateral surface of the ceramic body and electrically connected to the first internal electrode and a second external electrode formed on the second lateral surface and electrically connected to the second internal electrode; and metal layers formed on the first external electrode and the second external electrode, respectively, and including copper (Cu), wherein when a thickness of the metal layers is tp, tp&#x2267;5 &#x3bc;m may be satisfied.

Embedded multilayer ceramic electronic component and printed circuit board having embedded multilayer ceramic electronic component

There are provided an electronic component and a fabrication method thereof. The electronic component includes: a ceramic main body including end surfaces in a length direction, side surfaces in a width direction and top and bottom surfaces in a thickness direction; first and second external electrodes formed on the end surfaces, respectively; third and fourth external electrodes formed on the side surfaces, respectively; first internal electrodes formed within the ceramic main body and connected to first and second external electrodes; and second internal electrodes alternately arranged with the first internal electrodes, while having a ceramic layer interposed therebetween, and connected to the third and fourth external electrodes, wherein thickness tand tof the first and second internal electrodes is 0.9 &#x3bc;m or less, while a roughness Rof the first internal electrode is lower than a roughness Rof the second internal electrode.

Electronic component and fabrication method thereof

A multilayer ceramic capacitor may have low equivalent series inductance (ESL), in which via electrodes are opposed to each other diagonally and be off-centered from positions corresponding to center points of external electrodes, so that a distance between the via electrodes is significantly reduced and a current path is reduced.

Multilayer ceramic capacitor

There is provided a multilayer ceramic electronic part to be embedded in a board, including: a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other; first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first external electrode includes a first base electrode and a first terminal electrode formed on a portion of the first base electrode formed on at least one of the first and second main surfaces of the ceramic body, the second external electrode includes a second base electrode and a second terminal electrode formed on a portion of the second base electrode formed on at least one of the first and second main surfaces of the ceramic body.

Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein

There is provided a multilayer ceramic electronic part to be embedded in a board, including: a ceramic body including dielectric layers; first and second internal electrodes having first and second leads; and first and second external electrodes, wherein when lengths from edges of the first or second external electrode formed on first and second side surfaces of the ceramic body to points at which the first or second external electrode contacts the first and second leads are G, lengths from the edges of the first or second external electrode formed on first and second side surfaces of the ceramic body to a corresponding end surface of the ceramic body are BW, and lengths from the corresponding end surface of the ceramic body to points at which the first or second external electrode contacts the first and second leads are M, 30 &#x3bc;m&#x2266;G&#x3c;BW&#x2212;Mis satisfied.

There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7 &#x3bc;m or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a gap formed therebetween, wherein, when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 &#x3bc;m&#x2266;Gmin&#x2266;60 &#x3bc;m is satisfied.

Multilayer ceramic electronic component

There is provided a multilayer ceramic electronic component, including a ceramic body having first and second side surfaces facing each other, and first and second end surfaces facing each other; first and second internal electrodes having first and second lead portions; and first and second external electrodes extended from the first and second end surfaces of the ceramic body to the first and second side surfaces, respectively, wherein when a distance from an end portion of the first or second external electrode formed on the first or second side surface of the ceramic body to a point of the first or second external electrode connected to the first or second lead portion is defined as G, and a width of the first or second external electrode on the first or second side surface of the ceramic body is defined as BW, 30 &#x3bc;m&#x2266;G&#x3c;BW is satisfied.

Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein

A multilayer ceramic electronic part to be embedded in a board includes a ceramic body including dielectric layers and having main surfaces, side surfaces, and end surfaces; first and second internal electrodes including first and second leads exposed to the main surfaces; and first and second external electrodes formed on the end surfaces and extending to the main surfaces, wherein when a length from one of ends of the first or second external electrode formed on the main surfaces to a point at which the first or second external electrode contacts the first and second leads is G, a length from one of the ends of the first or second external electrode to the end surfaces is BW, and a length from the end surfaces to a point at which the first or second external electrode contacts the first and second leads is M, 30 &#x3bc;m&#x2266;G&#x3c;BM&#x2212;M is satisfied.

A multilayer ceramic electronic component to be embedded in a board includes: a ceramic body including dielectric layers; first and second internal electrodes formed in the ceramic body; and first-polarity external electrodes connected to the first internal electrodes, and second-polarity external electrodes connected to the second internal electrodes, wherein the number of the first-polarity external electrodes and the number of the second-polarity external electrodes may be two or more, the first-polarity and second-polarity external electrodes may include first-polarity and second-polarity base electrodes and first-polarity and second-polarity terminal electrodes formed on the first-polarity and second-polarity base electrodes, respectively, when L denotes a length of the ceramic body and W denotes a width thereof, W/L&#x2267;0.6 may be satisfied, and a width BW of each of the first-polarity and second-polarity external electrodes formed on the first and second main surfaces of the ceramic body may satisfy 150 &#x3bc;m&#x2266;BW&#x2266;350 &#x3bc;m.

A multilayer ceramic capacitor includes a ceramic body; an active layer including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body with a dielectric layer interposed therebetween; upper and lower cover layers formed on upper and lower surfaces of the active layer; and first and second external electrodes formed on the end surfaces of the ceramic body, wherein when a thickness of the ceramic body is defined as T, a thickness of the active layer is defined as S, a thickness of the lower cover layer is defined as C, and a distance from an end of a lowermost internal electrode in a length direction to an end of a band portion of an external electrode close to the end of the lowermost internal electrode is defined A, 0.25&#x2266;S/T&#x2266;0.75 and 3&#x2266;A/C&#x2266;10 are satisfied.

Multilayer ceramic capacitor and method of manufacturing the same

There is provided a multilayer ceramic capacitor to be embedded in a board, including: a ceramic body; first and second internal electrodes alternately exposed through end surfaces of the ceramic body; first and second external electrodes formed on end surfaces of the ceramic body; and first and second plating layers enclosing the first and second external electrodes, wherein when distance from one end of bands of the first or second external electrode to the other end thereof is 'A' and distance between points at which a virtual line drawn from a point vertically spaced apart from a surface of the first or second plating layer at a point &#xbd;&#xd7;A from one end of the bands inwardly of the ceramic body by 3 &#x3bc;m in length direction of the ceramic body intersects points on the surface of the first or second plating layer is 'B,' B/A&#x2267;0.6.

Multilayer ceramic capacitor to be embedded in board, method of manufacturing the same, and method of manufacturing board having multilayer ceramic capacitor embedded therein

Growing community of inventors

Gyunggi-do, South Korea

Eun Hyuk Chae