Corning Precision Materials Co., Ltd.

Eun Heui Choi

Bo Kyung Kong

Jin Soo An

Woo Jin Lee

Gyung Soo Kang

Chang Moog Rim

Young Seon Park

The present invention relates to a flexible substrate bonding method and, more particularly, to a bonding method for bonding a flexible substrate to a carrier substrate in order to facilitate handling of the flexible substrate. To this end, the present invention provides a flexible substrate bonding method comprising: a substrate preparation step for preparing a carrier substrate and a flexible substrate; and a bonding step for bonding the carrier substrate to the flexible substrate, which rotates by being wound around a rotation roll, while moving the carrier substrate by a transfer unit, wherein the bonding step includes bringing one edge of the flexible substrate into contact with the carrier substrate, and then gradually bonding the flexible substrate to the carrier substrate in a direction from one side to the other side.

Flexible substrate bonding method

The present invention relates to a method for handling an ultra-thin glass for a display panel and, more specifically, the invention enables the ultra-thin glass to be easily attached to or detached from a carrier glass for supporting the ultra-thin glass before and after a surface treatment process for applying the ultra-thin glass to a display panel. To this end, the method for handling an ultra-thin glass for a display panel, according to the present invention, comprises: a bonding step for bonding an ultra-thin glass and a carrier glass for supporting the ultra-thin glass by means of a phase transition material; a surface treatment step for treating a surface of the ultra-thin glass; and a separation step for separating the ultra-thin glass from the carrier glass.

Method for handling ultra-thin glass for display panel

Growing community of inventors

Chungcheongnam-do, South Korea

Eun Heui Choi