Samsung Electronics Co., Ltd.

Eun Chu Oh

Junjin Kong

Hong Rak Son

Jun Jin Kong

Junyeong Seok

Younggul Song

Byungchul Jang

Dae Seok Byeon

Ji Su Kim

Dong Jin Shin

Ji Sang Lee

Pilsang Yoon

Young-Jin Cho

Younggeon Yoo

Dongsup Jin

JongHa Kim

Young-geun Lee

Daeseok Byeon

Jisu Kim

KyoungLae Cho

Taehyun Song

Dongjin Shin

Jinbae Bang

Jaehong Kim

Youngjin Cho

Young-Sik Kim

Kijun Lee

Hong-Rak Son

Joonsung Lim

Jin-Hyeok Choi

Pil Sang Yoon

Beomkyu Shin

Younggeun Lee

Wijik Lee

Seong Hyeog Choi

Young Bae Kim

Jeong-ho Lee

Mankeun Seo

Young-Geon Yoo

MinHo Kim

Amir Bennatan

Han-shin Shin

Han Shin Shin

Amitai Perlstein

Jongha Kim

Hee-hyun Nam

A non-volatile memory device is provided. The non-volatile memory device includes: sub-blocks provided on a substrate. The sub-blocks include: a first sub-block connected to a first word line group including a first number of word lines; and a second sub-block connected to a second word line group including a second number of word lines. The first sub-block includes: at least one first memory cell storing M-bit data; and second memory cells each storing N-bit data. The second sub-block includes: at least one third memory cell storing K-bit data; and fourth memory cells each storing L-bit data. M, N, K, and L are positive integers, N is greater than M, and L is greater than K. The first number and the second number are different, and the at least one first memory cell and the at least one third memory cell include different numbers of memory cells.

Non-volatile memory device including sub-blocks having different sizes and storage device

A non-volatile memory device includes a substrate, a stack structure that includes a first gate layer that extends in a horizontal direction and a second gate layer that extends in the horizontal direction and is disposed apart from the first gate layer in a vertical direction, a plurality of first channel structures that penetrate in the vertical direction through a first channel region of the stack structure, a plurality of second channel structures that penetrate in the vertical direction through a second channel region of the stack structure, a first anti-fuse structure and a second anti-fuse structure that each penetrate in the vertical direction through an anti-fuse region of the stack structure, a first anti-fuse transistor that is electrically connected to the first gate layer through the first anti-fuse structure, and a second anti-fuse transistor that is electrically connected to the second gate layer through the second anti-fuse structure.

Non-volatile memory device and method of manufacturing the same

A method of operating a memory system includes programming, in a memory device, K logical pages stored in a page buffer circuit into a memory cell array, reading, from the memory device, the K logical pages programmed into the memory cell array into the page buffer circuit after a first delay time elapses, transmitting, in a memory controller, N−K logical pages to the memory device, and programming, in the memory device, N logical pages into the memory cell array based on the read K logical pages and the N−K logical pages, wherein K is a positive integer and N is a positive integer greater than K.

Memory device, memory system, and method of operating the memory system

A storage device includes a nonvolatile memory device including a memory cell array and a storage controller to control the nonvolatile memory device. The memory cell array includes word-lines, memory cells and word-line cut regions dividing the word-lines into memory blocks. The storage controller includes an error correction code (ECC) engine including an ECC encoder and a memory interface. The ECC encoder performs a first ECC encoding operation on each of sub data units in user data to generate parity bits and generate a plurality of ECC sectors, selects outer cell bits to be stored in outer cells to constitute an outer ECC sector including the outer cell bits and performs a second ECC encoding operation on the outer ECC sector to generate outer parity bits. The memory interface transmits, to the nonvolatile memory device, a codeword set including the ECC sectors and the outer parity bits.

Storage devices and methods of operating storage devices

A storage device, including a nonvolatile memory device and a storage controller configured to control the nonvolatile memory device. The nonvolatile memory device includes a memory cell array including a plurality of word-lines stacked on a substrate, a plurality of memory cells provided in a plurality of channel holes, and a word-line cut region dividing the plurality of word-lines into a plurality of memory blocks. The storage controller groups a plurality of target memory cells into outer cells and inner cells. The storage controller includes an error correction code (ECC) decoder configured to perform an ECC decoding operation by obtaining outer cell bits and inner cell bits during a read operation on the plurality of target memory cells, and applying different log likelihood ratio (LLR) values to the outer cell bits and the inner cell bits.

The present disclosure provides storage devices and methods for operating the same. In some embodiments, a storage device includes a non-volatile memory including a plurality of sub-blocks that are independently erasable, and a processor configured to control a garbage collection operation on the plurality of sub-blocks. The plurality of sub-blocks includes a plurality of first sub-blocks that have a first block size and a plurality of second sub-blocks that have a second block size. The second block size is different from the first block size. The processor is further configured to select a victim sub-block with a lowest ratio of a valid page count to an invalid page count from among the plurality of sub-blocks, and copy a valid page of the victim sub-block to a target sub-block from among the plurality of sub-blocks.

Storage device and operating method of storage controller

A storage device includes a non-volatile memory device. The non-volatile memory device includes a first substrate including a first peripheral circuit region including a row decoder selecting one word line from among a plurality of word lines of a three-dimensional (3D) memory cell array and a second substrate including a second peripheral circuit region, including a page buffer unit selecting at least one bit line from among a plurality of bit lines of the 3D memory cell array, and a cell region including the 3D memory cell array formed in the second peripheral circuit region. The 3D memory cell array is disposed between the first peripheral circuit region and the second peripheral circuit region by vertically stacking and bonding the second substrate on and to the first substrate.

Storage device using wafer-to-wafer bonding and method of manufacturing the same

A nonvolatile memory device includes a memory cell array and a control circuit. The memory cell array includes a plurality of word-lines, a plurality of memory cells provided in a plurality of channel holes and a word-line cut region extending in a first horizontal direction and dividing the word-lines into a plurality of memory blocks. A plurality of target memory cells coupled to each of the plurality of word-lines are grouped into outer cells and inner cells based on a location index of each of the plurality of memory cells. The control circuit controls a program operation on target memory cells coupled to a target word-line of the plurality of word-lines such that each of the outer cells stores a first number of bits and each of the inner cells stores a second number of bits. The second number is a natural number greater than the first number.

Nonvolatile memory devices for reducing degradation due to difference of threshold voltage distributions between outer cells and inner cells

A storage device includes a NAND flash memory device, an auxiliary memory device and a storage controller to control the NAND flash memory device and the auxiliary memory device. The storage controller includes a processor, an error correction code (ECC) engine and a memory interface. The processor executes a flash translation layer (FTL) loaded onto an on-chip memory. The ECC engine generates first parity bits for user data to be stored in a target page of the NAND flash memory device based on error attribute of a target memory region associated with the target page, and selectively generates additional parity bits for the user data under control of the processor. The memory interface transmits the user data and the first parity bits to the NAND flash memory device, and selectively transmits the additional parity bits to the auxiliary memory device.

A method of operating a memory system that comprises a memory device including a plurality of memory blocks and a memory controller, includes detecting a first memory block having a degradation count greater than or equal to a first reference value by the memory controller. A first command for the first memory block is transmitted to the memory device by the memory controller. A first voltage is applied to all of a plurality of word lines connected to the first memory block and a second voltage to a bit line connected to the first memory block in response to the first command by the memory device. The first voltage is greater than a voltage applied to turn on memory cells connected to all of the plurality of word lines. The second voltage is greater than a voltage applied to the bit line during program, read or erase operations.

Memory system for performing recovery operation, memory device, and method of operating the same

A three-dimensional (3D) storage device using wafer-to-wafer bonding is disclosed. In the storage device, a first chip including a peripheral circuit region including a first control logic circuit configured to control operation modes of a nonvolatile memory (NVM) device is wafer-bonded with a second chip including 3D arrays of NVM cells, and a memory controller includes a third chip including a control circuit region. The control circuit region of the third chip includes a second control logic circuit associated with operation conditions of the NVM device, and the second control logic circuit includes a serializer/deserializer (SERDES) interface configured to share random access memory (RAM) in the memory controller and transmit and receive data to and from the NVM device.

Three-dimensional (3D) storage device using wafer-to-wafer bonding

A storage device including, a plurality of non-volatile memories configured to include a memory cell region including at least one first metal pad; and a peripheral circuit region including at least one second metal pad and vertically connected to the memory cell region by the at least one first metal pad and the at least one second metal pad, and a controller connected to the plurality of non-volatile memories through a plurality of channels and configured to control the plurality of non-volatile memories, wherein the controller selects one of a first read operation mode and a second read operation mode and transfers a read command corresponding to the selected read operation mode to the plurality of non-volatile memories, wherein one sensing operation is performed to identify one program state among program sates in the first read operation mode, and wherein at least two sensing operations are performed to identify the one program state among the program states in the second read operation mode.

Non-volatile memory device, operating method thereof, and storage device having the same

A memory system for performing a recovery operation is provided. A memory system includes a memory device including a plurality of memory cells constituting a plurality of sub-sets, and a memory controller for controlling the memory device. The memory controller controls the memory device to manage a read count indicating a number of read operations performed by the memory device for each of the plurality of sub-sets, and to perform a recovery operation on a sub-set, among the plurality of sub-sets, based on the read count corresponding to the read count. Each of a plurality of sub-sets includes a plurality of pages. Each of the plurality of pages is a unit in which a read operation is performed in the plurality of memory cells.

Memory controller performing recovery operation, operating method of the same, and memory system including the same

A non-volatile memory device including: a page buffer configured to latch a plurality of page data constituting one bit page of a plurality of bit pages, and a control logic configured to compare results of a plurality of read operations performed in response to a high-priority read signal set to select one of a plurality of read signals included in the high-priority read signal set as a high-priority read signal, and determine a low-priority read signal corresponding to the high-priority read signal, wherein the high-priority read signal set is for reading high-priority page data, and the low-priority read signal is for reading low-priority page data.

Non-volatile memory device and a read method thereof

Growing community of inventors

Hwaseong-si, South Korea

Eun Chu Oh