Samsung Sdi Co., Inc.

Cheil Industries Inc.

Eun-Bi Park

Sang-Soo Kim

Jong-Hwa Lee

Ji-Yun Kwon

Eun-Ha Hwang

Kun-Bae Noh

Bum-Jin Lee

Jae-Yeol Baek

Jin-Hee Kang

Jin-Young Lee

Dae-Yun Kim

Sang-Kyeon Kim

Jae-Hwan Song

Eun-Kyoung Youn

Chung-Beum Hong

In-Chul Hwang

Sang-Haeng Lee

Yong-Tae Kim

Seung-Jib Choi

Ju-Ho Jung

Kyung-Hee Hyung

Se-Young Choi

Chang-Ryul Lee

Mi-Jin Choi

Jae-Young Kwon

Jung-Sun Lee

A photosensitive resin composition includes (A) a binder resin including an epoxy resin; (B) a photopolymerizable monomer; (C) a photopolymerization initiator; (D) a colorant including a dye represented by the following Chemical Formula 1, wherein in the above Chemical Formula 1, each substituent is the same as defined in the detailed description; and (E) a solvent. 

Photosensitive resin composition and color filter using the same

Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a first dissolution-controlling agent including at least one of compounds represented by the following Chemical Formula 1 or Chemical Formula 2; (D) a second dissolution-controlling agent including a compound represented by the following Chemical Formula 3; and (E) a solvent, and a photosensitive resin film and a display device using the same.

Positive photosensitive resin composition, and photosensitive resin film and display device prepared by using the same

Disclosed is a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a cross-linking agent; (D) a thermal acid generator; (E) a phenol compound; and (F) an organic solvent, wherein the cross-linking agent and thermal acid generator are included in a weight ratio of about 1:50 to about 50:1.

Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device

Disclosed are a photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a phenol compound; (D) a thermal acid generator; and (E) a solvent, wherein the solvent includes an organic solvent having a boiling point of less than about 160&#xb0; C. under an atmospheric pressure and an organic solvent having a boiling point of greater than or equal to about 160&#xb0; C. under an atmospheric pressure, wherein the organic solvent having a boiling point of less than about 160&#xb0; C. is included in an amount of greater than or equal to about 90 wt % and less than about 100 wt % based on the total amount of the solvent, and the organic solvent having a boiling point of greater than or equal to about 160&#xb0; C. is included in an amount of greater than about 0 wt % and less than or equal to about 10 wt % based on the total amount of the solvent, a photosensitive resin film using the same, and a display device.

A photosensitive resin composition for an insulating film of a display device includes (A) an alkali soluble resin including a polybenzoxazole precursor, polyamic acid, polyimide, or a combination thereof; (B) a photosensitive diazoquinone compound; (C) an ultraviolet (UV) absorber having a maximum absorption wavelength of about 300 to about 400 nm; and (D) a solvent. An insulating film and a display device can include the photosensitive resin composition.

Photosensitive resin composition for insulating film of display device, insulating film using the same, and display device using the same

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Suwon-si, South Korea

Eun-Bi Park