Samsung Electro-mechanics Co., Ltd.

Eun Bae Park

Jong Yun Kim

Gye Won Lee

Hong Seok Lee

Chang Ju Lee

Hee Sun Oh

Nam Gyun Yim

Woo Sung Jung

Mi Jung Kim

A module substrate includes a module substrate including a plurality of external connection electrodes disposed on a second surface thereof; communication elements mounted on the module substrate, the communication elements including one or more first communication elements mounted on a first surface of the module substrate and one or more second communication elements mounted on the second surface of the module substrate; a first heat radiation frame mounted on the first surface of the module substrate and configured to accommodate at least one of the one or more first communication elements; and a second heat radiation frame mounted on the second surface of the module substrate and configured to accommodate at least one of the one or more second communication elements. One or more of the external connection electrodes are disposed around the second heat radiation frame.

Communication module and mounting structure thereof

Growing community of inventors

Suwon-si, South Korea

Eun Bae Park