Hynix Semiconductor Inc.

Skhynix Inc.

Eul Chul Jang

Sang Joon Lim

Bok Kyu Choi

Sung Woo Han

Qwan Ho Chung

Package substrates are provided. The package substrate may include a power line and a ground line on a first surface of a substrate body; a plurality of signal lines on the first surface between the power line and the ground line; and a lower ground pattern and a lower power pattern positioned on a second surface of the substrate body opposite to the first surface. The lower ground pattern may be disposed to be opposite to the power line and the lower power pattern may be disposed to be opposite to the ground line. Related semiconductor packages are also provided.

Electrical characteristics of package substrates and semiconductor packages including the same

A circuit board having a board body includes a via structure. The via structure includes a conductive connector passing through the board body and a conductive shield member surrounding at least a portion of the conductive connector. The shield member prevents distortion of a data signal applied to the conductive connector, and also intercepts electromagnetic waves generated by the conductive connector.

Growing community of inventors

Gyeonggi-do, South Korea

Eul Chul Jang