Applied Materials, Inc.

Eui Kyoon Kim

Ganesh Balasubramanian

Visweswaren Sivaramakrishnan

Karthik Janakiraman

Jianhua Zhou

Thomas E Nowak

Amir Hamed Al-Bayati

Mohamad A Ayoub

Mark A Fodor

Dale R Dubois

Chiu Chan

Joseph C Werner

Ashish Shah

Embodiments described herein relate to a substrate processing system that integrates substrate edge processing capabilities. Illustrated examples of the processing system include, without limitations, a factory interface, a loadlock chamber, a transfer chamber, and one or more twin process chambers having two or more processing regions that are isolatable from each other and share a common gas supply and a common exhaust pump. The processing regions in each twin process chamber include separate gas distribution assemblies and RF power sources to provide plasma at selective regions on a substrate surface in each processing region. Each twin process chamber is thereby configured to allow multiple, isolated processes to be performed concurrently on at least two substrates in the processing regions.

Systems for plasma enhanced chemical vapor deposition and bevel edge etching

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Campbell, CA, United States of America

Eui Kyoon Kim