H.b. Fuller Licensing & Financing Inc.

H.b. Fuller Company

The Dow Chemical Company

Eugene R Simmons

Jeffrey S Lindquist

Thomas F Kauffman

William L Bunnelle

Mark S Kroll

Steven L Scholl

David B Malcolm

Janelle C Cameron

John P Baetzold

Keith C Knutson

Margarita Acevedo

Christopher E Olson

Kathryn A Coleman

Kevin J Sweeney

Fouad D Mehawej

James R Farmer

Freddie C Carter

Selim Yalvac

Deepak R Parikh

Malcolm F Finlayson

Cynthia L Rickey

Brian W Carlson

David R Speth

Kevin W McKay

Carolyn A Fischer

Lowell G Lindquist

Jimmy D Allen

Carolyn M Anderson

Michael S Keehr

Brian H Glasbrenner

James P Szymanski

Mary E Foster

Donald P Woodbridge

A thermoplastic composition that includes from about 1% by weight to 25% by weight block copolymer having the formula (A-B)x or A-B-A, where the A block includes polyvinylarene, the B block includes poly(monoalkenyl) and x is an integer of at least one, spherical superabsorbent particles comprising polyacrylate, and plasticizing oil, the composition exhibiting water gel time of no greater than 2 minutes, a viscosity of no greater than 100,000 centipoise and a wet tensile strength of at least 15 g/in.

Superabsorbent thermoplastic composition and article including same

Disclosed are adhesives and processes for preparing the same, comprising at least one first homogeneous ethylene/&#x3b1;-olefin interpolymer, and optionally at least one tackifier, and optionally at least one plasticizer. The claimed adhesives are useful as adhesives such as are employed in various applications, such as in masking tape, clear office tape, labels, decals, bandages, decorative and protective sheets (such as shelf and drawer liners), floor tiles, sanitary napkin/incontinence device placement strips, sun control films, the joining of gaskets to automobile windows, packaging, bookbinding, construction of nonwoven articles, and insulation bonding.

Adhesives comprising olefin polymers

The invention is directed to a radiation curable adhesive composition comprising at least one vinyl modified block copolymer having a first polyvinyl aromatic block and a second polydiene block having vinyl functionality, and at least one tackifier. Optionally, the composition may comprises at least one second block copolymer that has not been vinyl modified, at least one platicizer, and at least one wax. The invention is also directed to a double-faced label formed from the composition and the method of producing said label.

Radiation curable adhesive compositions comprising block copolymers having vinyl functionalized polydiene blocks

A thermoplastic composition that includes from about 1% by weight to 25% by weight block copolymer having the formula (A-B)x where the A block includes polyvinylarene, the B block includes poly(monoalkenyl) and x is an integer of at least one, spherical superabsorbent particles comprising polyacrylate, and plasticizing oil, the composition exhibiting water gel time of no greater than 2 minutes, a viscosity of no greater than 100,000 centipoise and a wet tensile strength of at least 15 g/in.

A moisture curable composition that includes a polyurethane prepolymer comprising the reaction product of a) a polyol having an unsaturation of less than 0.02 meq/g; and b) a polyfunctional isocyanate, where the composition forms a pressure sensitive adhesive when cured, is disclosed.

Moisture curable polyurethane compositions

The present invention is a hot melt adhesive composition comprising at least one ingredient present in an encapsulated form. The encapsulated ingredient may be any known hot melt adhesive formulation ingredient as well as any hot melt adhesive additive such as antioxidants and fragrances for which there is a desirable change in adhesive properties by isolating such ingredient for a duration of time. The encapsulated ingredient is released from the shell by means of pressure, temperature, diffusion, pH, light, radiation, ultrasound, and combinations thereof. Hot melt adhesive compositions comprising at least one encapsulated ingredient are useful for a variety of novel products including self-supported friction glue sticks, non-tacky pelletized pressure sensitive adhesives, cohesive adhesive systems, hot melt adhesive compositions exhibiting improved thermal stability and odor, as well as for a variety of other adhesive applications.

Hot melt adhesive comprising an encapsulated ingredient

Foamable compositions comprising low viscosity thermoplastic material

A polymeric composition in pellet form comprising a tacky hot melt composition, comprising a) from about 5% by weight to about 90% by weight of a thermoplastic polymer, b) from about 0% by weight to about 65% by weight of a tackifying resin, c) from about 0% to about 50% by weight of a plasticizer, d) up to about 2% by weight of an antioxidant, and a pelletizing aid, wherein the tacky hot melt composition has some minimum amount of tackifier or plasticizer and is a pressure sensitive adhesive having a storage modulus, G', at about 25.degree. C., of less than about 5.times.10.sup.6 dynes/cm.sup.2, and each pellet has a substantially tack-free surface. This invention further discloses a polymeric composition in pellet form suitable for molding articles. The composition comprises a tacky hot melt composition comprising at least one high molecular weight triblock copolymer of the general configuration A-B-A and a plasticizer and a pelletizing aid. The pelletizing aid substantially surrounds the tacky composition such that the molded articles are substantially free from surface tack. A method of forming the pellets is also disclosed.

Polymeric composition in pellet form

This invention relates to an envelope coated with a hot melt pressure sensitive adhesive composition preferably comprising a) from about 10% to about 40% by weight in the adhesive of at least one block copolymer selected from the group consisting of styrene-isoprene-styrene block copolymers, styrene-butadiene-styrene block copolymers and mixtures thereof wherein the block copolymers comprise from about 15% to about 35% styrene by weight in the copolymer and diblock contents from about 0% to about 90% by weight in the copolymer; and b) from about 60% to about 90% by weight in the adhesive of a modifier selected from the group consisting of solid tackifying resins, liquid tackifying resins, liquid elastomers and mixtures thereof. The invention further relates to an improved oil-free pressure sensitive adhesive that is low in viscosity and provides a destructive bond and resists deformation of high density spun polyolefin materials.

Hot melt pressure sensitive adhesive designed for use on high density

This invention relates to hot melt adhesives comprising a high molecular weight polystyrene-ethylene/butylene-polystyrene block copolymer and articles constructed therefrom. This polymer is useful in a variety of hot melt adhesive applications such as food packaging adhesives, rodent traps, skin attachment adhesives, positioning adhesives, diaper tapes, low tack diaper fastening systems, foam in place gaskets, etc.

High molecular weight S-EB-S hot melt adhesive

Hot melt adhesives which include at least 5% of a thermoplastic elastomer block copolymer having a Vicat softening temperature of at least 60.degree. C. and a melting point of at least 100.degree. C., have improved thermal resistance properties and can be applied with conventional hot melt application equipment at temperatures of between about 149.degree. C. and about 204.degree. C. The adhesives are particularly suited to use in above-the-belt locations in automobile interiors and in furniture bonding. Especially suitable thermoplastic elastomers are polyether-polyester and polyether-polyamide segmented polymers with melting points above 149.degree. C. Hot melt adhesives based on these thermoplastic elastomers can be formulated to provide a range of properties including pressure sensitive properties and contact adhesive properties.

Hot melt adhesive composition

An improved hot melt adhesive with low self-adhesion. The adhesive is useful for disposable articles and employs a S-EB-S block copolymer. The adhesive does not require a release liner and has superior stay-in-place properties.

Polystyrene-ethylene/butylene-polystyrene hot melt adhesive

Growing community of inventors

Vadnais Heights, MN, United States of America

Eugene R Simmons