Applied Materials, Inc.

Ahbee 2, L.p., a California Limited Partnership

Eugene Fukshansky

Visweswaren Sivaramakrishnan

Jonathan Stuart Frankel

Thanh Ngoc Pham

Vitali Souchkov

Inna Shmurun

Vladimir Faifer

David P Wanamaker

Alexander Artjomov

Anatoli Skljarnov

Victor Huang

The invention relates to metrology of thin dielectric layers on semiconductor wafers, interfaces of dielectric layers to the wafer substrates and substrates properties of semiconductor wafers. The invention allows measurement of the metrology data for thin dielectric layers on semiconductor wafers electrically via using contact electrodes that align their contact surface to the wafer surface locally at the measurement sites.

Apparatus for measuring of thin dielectric layer properties on semiconductor wafers with contact self aligning electrodes

The present invention provides systems, methods and apparatus for high temperature (at least about 500-800.degree. C.) processing of semiconductor wafers. The systems, methods and apparatus of the present invention allow multiple process steps to be performed in situ in the same chamber to reduce total processing time and to ensure high quality processing for high aspect ratio devices. Performing multiple process steps in the same chamber also increases the control of the process parameters and reduces device damage. In particular, the present invention can provide high temperature deposition, heating and efficient cleaning for forming dielectric films having thickness uniformity, good gap fill capability, high density, low moisture, and other desired characteristics.

Lid assembly for high temperature processing chamber

A method and apparatus is provided which secures the lid of a processing chamber in abutting engagement with the walls of the chamber to form an airtight processing environment and which provides for the release of pressure within the chamber in the event of a sudden change in pressure such as an over pressure excursion. The method and apparatus generally comprise a clamp member having a base portion for mounting the clamp to a first surface, a contact portion for contacting a second surface and maintaining a desired relationship between the first and second surfaces, and a deflecting portion which allows separation of the first and second surfaces to relieve pressure behind the first or second surface and return to the desired relationship between the first and second surfaces.

Pressure responsive clamp for a processing chamber

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Mountain View, CA, United States of America

Eugene Fukshansky