Motorola Corporation

Other

Eugene E Segerson

David L Vowles

Henry E Geist

Floyd L Thomas

David D Hanson

Leo L Lehner

A fiber optic cable connection having easy cable insertion and greater pull strength is obtained by providing a cable connector (30) embodying a tapered, partially split sheath (38) around the cable (18) in a tapered hole (36) in the connector body (32) and a compression nut (34) for adjusting the compression of the partially split sheath (38). When the cable (18) is inserted, springy legs (42) on the tapered sheath (38) bend apart to allow easy insertion. When an attempt is made to withdraw the cable (18) ends (44) of legs (42) bite into the cable, resisting removal. The compression nut (34) permits disassembly of the connector (30) if desired and allows adjustment of the cable clamping force. The tapered sheath (38) may be easily removed without damage to the cable (18).

Fiber optic cable retainer

An improved semiconductor device package and method include, in a first embodiment, a die supporting leadframe having fingers inside the package body which are interleaved with mating fingers of a metallic heat extractor, without touching. A thermally conductive encapsulation fills the spaces between and around the fingers to provide thermal coupling and electrical isolation. The heat extractor extends outside the package body. Alternatively, the heat extractor and the leadframe have large parallel faces inside the package body which are arranged in a face-to-face relationship, without touching. An insulating spacer locks the opposing faces in the spaced-apart, electrically isolated relationship. An encapsulation fills any remaining space between the faces to provide efficient thermal coupling.

Electrically isolated heatsink for single-in-line package

An improved vehicle height sensor and automotive leveling system are described using, in a preferred embodiment, two optical emitter-receiver pairs mounted in the sidewall or dust cover of a standard automotive air shock. The emitter-receiver pairs are arranged to operate by reflecting light from the central shaft of the shock absorber. Each emitter-receiver pair provides a light path that lies in a plane substantially perpendicular to the extension direction of the shock. The two emitter receiver pairs are spaced apart along the extension direction of the shock. Movement of the internal piston of the shock successively interrupts (by absorption) the light paths of the emitter-receiver pairs so as to provide a positive indication of the location of the movable piston and hence the height of the shock and the height of vehicle body above the road. The emitter-receiver pairs are mounted in a common assembly and seal to the shock dust cover through a single hole. They are convenient to manufacture in a single module which includes the control logic needed to add to remove fluid from the shock to maintain it in reference position independent of the vehicle load. This makes possible a particularly compact unit.

Apparatus employing reflective optical means

A steering module assembly having a contoured housing unit to receive a PC board which has soldered to it a plurality of optoelectronic devices wherein neither said plurality of optoelectronic devices nor said PC board come in direct contact with the housing unit. The PC board also has a saddle element which contains snap retainers to receive each of said plurality of optoelectronic devices. A fitted cover encloses the housing unit.

Shock proof steering module assembly

A package for optoelectronic devices is disclosed having means for receiving the end of an optical fiber. The package fastens to the fiber by means of a collet chuck which is part of the package. The chuck is closed by rotating a collar.

Connectorless fiber optic package

An improved lead frame is provided for the manufacture of high heat dissipating semiconductor devices having a large heat sink metallic portion exposed with plastic encapsulating material partially disposed thereabout. A semiconductor unit is mounted directly on the heat sink such that high heat dissipation is obtained. The lead frame provides for pairs of metallic heat sink portions joined to a interdigitated center lead frame portion such that the interdigitation of the semiconductor device leads associated with each of the opposed heat sink portions provides for a high density lead frame structure from which a minimum of material must be removed in the fabrication process. The center lead frame portion comprises two parallel interconnecting rails or tie bars which provide a dual function in that they provide a mold stop for subsequent plastic encapsulation fabrication steps while simultaneously providing a support for alignment hole means which provide indexing of the lead frame and associated opposed heat sink portions through various automated manufacturing steps. The use of a composite lead frame structure wherein the metallic heat sink portion is joined to the center lead frame structure allows great versatility in the types of material and the types of fabrication steps used to provide a semiconductor device thus allowing manufacture at greatly reduced cost.

Growing community of inventors

Tempe, AZ, United States of America

Eugene E Segerson