Thomson-csf

Alcatel Cit

Societe Anonyme Dite: Alcatel Cit

Eugene Duda

Emmanuel Grard

Claude Tondu

Alain Maumy

Jean Claude Dubois

Raymond Henry

Daniel Mousseaux

Jacques Auge

Jean E Picquendar

Jean-Jacques Guerin

Jean-Luc Beylat

Jacques Mouchart

Jean C Carballes

Jacqueline Begel

Michel Marchal

A DFB laser (2) is coupled to a monomode line fiber (14) via an isolator constituted by a Faraday rotator crystal (4) and a polarizing fiber (10) which is welded to a fiber to be coupled (14). A focusing lens (8) is integrated in an intermediate block including the rotator crystal (4) and a permanent magnet (6). The invention is particularly suitable for making light-emitting heads for use in optical fiber telecommunications systems.

Optical head with an integrated isolator for coupling a semiconductor

The invention relates in particular to polarizing light whose angle of incidence may vary substantially, e.g. over .+-.10.degree.. A polarizing stack (22) constituted by dielectric layers (30, 31, 32, 33, 34, . . . ) is formed on an oblique face (4). It is in the form of a repetitive sucession of symmetrical sequences (30, 31, 40) each constituted by two half-thickness low refractive index layers (30, 40) on either side of a high refracture index layer (31). The invention is particularly applicable to polarizing the light emitted by a semiconductor laser.

Dielectric layer polarizer

A process of aligning electro-optical devices that associate a semiconductor, laser diode or electroluminescent component with an optical component, such as an optical fiber. These devices must be aligned with a precision of from .+-.1 to .+-.10.mu.. The semiconductor component is integral with a centering part through the intermediary of a first bracket. The optical component, through the intermediary of a second bracket, is integral with a container in which is placed a hardening material. The centering part is plunged in the hardening material, with three degrees of mobility. The alignment is dynamic. When adjustment has been made, the hardening material is rapidly and rigidly fixed.

Alignment process for an electro-optical device

The invention relates to laser sources using a semiconductor chip from which the radiation is collected by an optical fiber. In accordance with the invention there is provided a laser source in which the support for the semiconductor chip and the optical fiber is metallic. The support is stamped with an impression comprising a seat for the semiconductor chip and at least one groove for accommodating the optical fiber. The invention is applicable to radiation sources used in optical telecommunication systems.

Method of manufacturing a laser source with stamped support

A GaAs diode and a copper base are joined together so as to form a soldered system comprising an indium layer inserted between two tungsten layers which serve as a barrier for preventing indium diffusion. A thin gold or platinum wetting layer is applied to the tungsten layers to aid in adherence of the solder to the tungsten without the impairment of the indium during soldering operations due to alloying. The invention is applicable to optical-fiber telecommunication systems.

System for soldering a semiconductor laser to a metal base

An improved process for forming an embossed pattern through the use of a writing concentrated beam opening holes in a film capable of undergoing residue free evaporation. A layer of photoresist is overlayed with the film and upon being exposed and processed the layer supplies the prospective embossed pattern.

Method of making an embossed pattern on an information bearing substrate

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Paris, France

Eugene Duda