Laird Technologies Gmbh

Other

Eugene Anthony Pruss

Jason L Strader

Richard F Hill

Vijayaraghavan Rajagopal

Gerald Robert English

Douglas S McBain

Michael Scott Poulsen

Keith David Johnson

Joseph C Boetto

Leonid Lev Shmagin

Björn Edgren

Karl Göran Olof Ihrefjord

Woongho Bang

Matthew Tapping

Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.

Compressible foamed thermal interface materials and methods of making the same

A device for absorbing energy from an electronic component includes a low melting alloy layer including a first side and a second side opposing the first side, and coating layers substantially covering the first side and the second side of the low melting alloy layer. In some embodiments, the low melting alloy layer includes a polymer mixture and a plurality of low melting alloy particulates dispersed in the polymer mixture. Other example devices are also disclosed.

Devices for absorbing energy from electronic components

Exemplary embodiments are disclosed of thermal management assemblies suitable for use (e.g., configured for heat spreading, etc.) with transceivers (e.g., small form-factor pluggable (SFP) transceivers, SFP+ transceivers, quad small form-factor pluggable (QSFP) transceivers QSFP+ transceivers, XFP transceivers, etc.) and other devices (e.g., memory card readers, etc.). In exemplary embodiments, a thermal management assembly comprises at least one flexible heat spreading material (e.g., a single graphite sheet, multiple graphite sheets, etc.) including portions wrapped (e.g., in different non-parallel directions, in parallel directions, etc.) around corresponding portions of a part, which may be configured to be coupled to and/or along a side of a device housing. The at least one flexible heat spreading material may be operable for defining at least a portion of a thermally-conductive heat path around the corresponding portions of the part.

Thermal management assemblies suitable for use with transceivers and other devices

Disclosed are exemplary embodiments of highly compliant non-silicone putties and thermal interface materials including the same. In an exemplary embodiment, a non-silicone putty includes at least one thermally-conductive filler and at least one other filler including hollow polymeric particles in a non-silicone polymer base or matrix. The non-silicone putty may have a thermal conductivity of at least about 3 Watts per meter-Kelvin and/or may have a hardness of less than about 30 Shore 00.

Highly compliant non-silicone putties and thermal interface materials including the same

Exemplary embodiments are disclosed of thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components.

Thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components

A multilayer board level shield includes an electrically-conductive shielding layer disposed between inner and outer dielectric layers. The multilayer board level shield may have an overall thickness of about 25 microns or less. The multilayer board level shield may have sufficient flexibility to be reconfigurable generally over one or more components on a substrate to thereby provide board level shielding for the one or more components. One or more dielectric joints may be defined between the printed circuit board and the outer dielectric layer that attach the multilayer board level shield to the printed circuit board.

Board level shields and systems and methods of applying board level shielding

In an exemplary embodiment, a device generally includes a housing, an external heat sink, and at least one of a thermal interface material and a thermoelectric module generally between a side of the housing and the external heat sink. At least one spring contact is coupled to the side of the housing generally between the connector and the at least one of a thermal interface material and a thermoelectric module. The at least one spring contact and the at least one of a thermal interface material and a thermoelectric module define at least a portion of a thermally-conductive heat path between the housing and the external heat sink. Graphite is wrapped around the at least one spring contact and/or a thermally-conductive and electrically-conductive material is wrapped around at least a portion of the thermal interface material.

Small form-factor pluggable (SFP) transceivers

Exemplary embodiments are disclosed of multifunctional components for electronic devices. In an exemplary embodiment, a multifunctional component generally includes a base component, such as a smart phone case (e.g., a back cover, etc.), an inner plate (e.g., a screenplate, a mid-plate, etc.). A heat spreader may be disposed on the base component. Thermal interface material and electromagnetic interference shielding may be disposed on area(s) of the heat spreader. The area(s) may correspond in mirror image relation to component(s) of a circuit board with which the multifunctional component is configured to be joined. During operation of the electronic device, the multifunctional component may draw waste heat from one area and transfer/spread the waste heat to one or more other areas of the electronic device, which may increase a temperature of these one or more other areas. This, in turn, may make device temperature more uniform.

Growing community of inventors

Avon Lake, OH, United States of America

Eugene Anthony Pruss