Heraeus Deutschland Gmbh & Co Kg

Heraeus Amloy Technologies Gmbh

Heraeus Materials Singapore Pte. Ltd.

Eugen Milke

Murali Sarangapani

Ralf Busch

Xi Zhang

Sven Thomas

Peter Prenosil

Elena Bien

Martin Schneider-Ramelow

Ute Geissler

Hans Jürgen Wachter

Alexander Elsen

Hans-Jürgen Wachter

Frank-Werner Wulff

Jürgen Dick

Hans Jurgen Wachter

Hamed Shakur Shahabi

Christian Pietsch

Ping Ha Yeung

Moritz Stolpe

Michael Klosch-trageser

Tim Gläser

Larbi Ainouz

Florian Theisen

Shahabi Shakur Hamed

Legaspi Pisigan

One aspect relates to an injection molding system for the injection molding of amorphous metals, an injection molding unit for the injection molding of amorphous metals and an injection molding process for amorphous metals. The injection molding system includes a channel for feeding a molten metal and a slider unit including a slider and a pressure system. The slider is located between the channel and at least one injection molding cavity and is movable between a rest position and an injection position. In the rest position, the slider blocks the access of the molten metal to the injection molding cavity and in the injection position it allows the molten metal to access the injection molding cavity. The pressure system holds the slider in the rest position and allows the slider to move to the injection position when a minimum pressure is exceeded.

Injection molding system for the injection molding of amorphous metals

The present invention relates to an alloy which has the following composition:Cu(TiZr)NiSnSiwhere

Copper-based alloy for the production of bulk metallic glasses

A wire, preferably a bonding wire for bonding in microelectronics, contains a copper core with a surface and coating layer containing aluminum superimposed over the surface of the copper core. The ratio of the thickness of the coating layer to the diameter of the copper core is from 0.05 to 0.2 &#x3bc;m. The wire has a diameter in the range of from 100 &#x3bc;m to 600 &#x3bc;m and specified standard deviations of the diameter of the copper core and of the thickness of the coating layer. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding.

Aluminum coated copper bond wire and method of making the same

An alloyed 2N copper wire for bonding in microelectronics contains 2N copper and one or more corrosion resistance alloying materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance alloying materials is between about 0.009 wt % and about 0.99 wt %.

Alloyed 2N copper wires for bonding in microelectronics devices

The invention is related to a bonding wire containing a core having a surface. The core contains aluminum as a main component and scandium in an amount between 0.05% and 1.0%.

Aluminum alloy wire for bonding applications

A bonding wire is provided containing a wire core made of a first material containing a metal and a wire jacket that envelopes the wire core and is made of a second material containing a metal. The wire core and the wire jacket are made of different metals and the bonding wire has an aspect ratio of no more than 0.8. The bonding wire efficiently prevents damage to bonding surfaces during the bonding process and short-circuiting during the use of corresponding sub-assemblies.

Core-jacket bonding wire

A ribbon, preferably a bonding ribbon for bonding in microelectronics, contains a first layer containing copper, a coating layer containing aluminum superimposed over the first layer, and an intermediate layer. In a cross-sectional view of the ribbon, the area share of the first layer is from 50 to 96% and the aspect ratio between the width and the height of the ribbon in a cross-sectional view is from 0.03 to less than 0.8. The ribbon has a cross-sectional area of 25,000 &#x3bc;mto 800,000 &#x3bc;m. The intermediate layer contains at least one intermetallic phase containing materials of the first and coating layers. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing the wire, to a propelled device comprising said electric device and to a process of connecting two elements through the wire by wedge-bonding.

Aluminum coated copper ribbon

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Nidderau, Germany

Eugen Milke