Intel Corporation

Eu Soon Lee

Yongki Min

Mooi Ling Chang

King Keong Wong

Kee Leong Cheah

Myitzu Soe Myat

Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be more precisely controllable. The number of die side capacitors may be reduced by combining embedded resistors with these capacitors to reduce costs. The embedded resistors may be provided within the metallization layers either at an upper layer or a lower layer, as two examples.

Embedding thin film resistors in substrates in power delivery networks

Embodiments of the invention relate to semiconductor packages in which electrical power is delivered to die-side components removably installed in sockets formed between a package stiffener and an electrical conductor. To this purpose, the package stiffener and the electrical conductor may be electrically coupled to the power and ground terminals of the semiconductor package.

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Kuala Lumpur, Malaysia

Eu Soon Lee