Hitachi, Ltd.

Renesas Technology Corp.

Etuo Egashira

Susumu Komoriya

Hiroshi Nishizuka

Hisashi Maejima

A wafer having chamfered bent portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer such as an orientation flatness. The chipping of the wafer can be prevented, and in coating the wafer with a photoresist, forming an epiaxially grown layer on the wafer, etc., films having desired characteristics can be provided on the surface of the wafer.

Wafer having chamfered bend portions in the joint regions between the contour of the cut-away portion of the wafer

A wafer having chamfered bent portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer such as an orientation flatness. The chipping of the wafer can be prevented, and in coating the wafer with a photoresist, forming an epitaxially grown layer on the wafer, etc., films having desired characteristics can be provided on the surface of the wafer.

Method of producing a wafer having a curved notch

Wafer having chamfered bend portions in the joint regions between the

Wafer and method of working the same

Growing community of inventors

Yamanashi, Japan

Etuo Egashira