Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Etsuo Tsujimoto

Hiroharu Nishiyama

Tetsuya Tsumura

Nobuyuki Matsui

Jumpei Hashiguchi

Koji Nakashima

Hideki Okura

Michihiro Miyauchi

Yoshiyuki Miyoshi

Fumiaki Hashimoto

Tomio Marui

Makoto Ono

Katsuhisa Kitada

It is an object to improve a conventional point that mounting an electronic component that requires a high current and heat radiation, such as an LED, together with other general electronic components on the same board has been difficult. To achieve this object, a different thickness lead frame partially having different thicknesses is used. On a thick portion of the different thickness lead frame, a special electronic component, such as an LED, for which a high current and heat radiation are required is mounted. Further, a thin portion of the different thickness lead frame is formed at a fine pitch, and general electronic components are mounted at a high density on the thin portion. Thus, unitization or modularization of electronic components for which a high current and heat radiation are required becomes possible.

Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board

A heat dissipating wiring board includes a metal wiring plate with a circuit pattern formed therein, a filler containing resin layer embedded with the metal wiring plate such that a top surface of the metal wiring plate is exposed, and a heat dissipating plate arranged on an under surface of the filler containing resin layer. The circuit pattern is formed of a through groove provided in the metal wiring plate. The through groove includes a fine groove that opens at the top surface of the metal wiring plate and an expanded groove that expands from a lower end of the fine groove toward the under surface of the metal wiring plate. The heat dissipating wiring board is capable of improving reliability against electric insulation due to dust or the like in a space of the through groove.

Heat dissipating wiring board and method for manufacturing same

A PDP (plasma display panel) is attached to an electrically conductive board with a heat dissipation sheet sandwiched therebetween. A first driving circuit board is fixed on the electrically conductive board by a plurality of electrically conductive supports. On one surface, which faces the electrically conductive board, of the first driving circuit board, one or a plurality of electronic components are mounted, while a second driving circuit board is fixed. A plurality of support terminals of the second driving circuit board are connected to the first driving circuit board, and the first driving circuit board is attached to the electrically conductive board by the electrically conductive supports. Thus, one surface of the second driving circuit board is in contact with the electrically conductive board. One or a plurality of surface mount components are mounted on the other surface of the second driving circuit board that faces the first driving circuit board.

Plasma display device

In a power conversion module device of the present invention, a transformer, a primary power element and a secondary power element are mounted on a printed wiring board in surface-to-surface contact therewith, and no control circuit is mounted thereon. In addition to reducing impedance and loss in the wiring, this constitution improves the voltage waveform of the primary power element. Thus, noise reduction can be achieved. Further, because heat can be transferred to the printed wiring board, heat generated from the transformer, the primary power element and the secondary power element can be reduced. The size of the transformer can also be reduced.

Power conversion module device and power unit using the same

Self oscillating power supply

Growing community of inventors

Mie, Japan

Etsuo Tsujimoto