Mitsui Chemicals, Inc.

Mitsui Toatsu Chemicals, Incorporated

Etsuo Ohkawado

Katsuhiko Funaki

Syuji Tahara

Kousuke Hirota

Takeshi Tsuda

Moritsugu Morita

Kazuhito Fujita

Koichi Takeuchi

Takayuki Kubo

Kenji Abe

Shuji Tahara

Kimiteru Tagawa

Akira Ibi

Shigeo Kiba

Kenji Tanabe

Naoshi Mineta

Masanori Kitagawa

Eiichi Sagawa

Disclosed is a photosensitive resin composition which does not contain any halogenated compound or any antimony compound that has a high risk of putting a load on the environment, which exerts good flame retardancy after being cured, and which particularly meets the recent exacting requirements with respect to bending resistance and insulation reliability. Specifically disclosed is a photosensitive resin composition comprising: (A) a (meth)acrylate compound represented by the general formula (1); (B) a polyimide precursor; and (C) a photopolymerization initiator [in the formula, Rrepresents a hydrogen atom or a methyl group; Rrepresents a hydrogen atom or a univalent organic group; n and m independently represent an integer of 1 to 5; p represents an integer of 0 to 6; q and r independently represent an integer of 0 to 4; and s represent an integer of 0 to 6, provided that the sum of p, q, r and s is 6, and the sum total of p and s may range from 3 to 6 and is preferably 6].

Photosensitive resin composition, dry film, and processed product made using the same

A photosensitive resin composition which is effective in avoiding troubles in the step of plating with various metals in printed wiring board production, such as under-film metal deposition and film peeling, and which forms a wiring-protecting film excellent in adhesion, flexibility, insulation reliability, and heat resistance. The photosensitive resin composition comprises (A) a carboxylated polymer, (B) a compound having at least two photopolymerizable unsaturated double bonds, (C) a photopolymerization initiator, and (D) a nitrogen compound represented by a specific feature.

The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent sever demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.

Resin composition, dry film, and processed product made using the same

A composition for forming a film for protecting wiring which in one aspect includes a polyimide precursor, a compound having at least two photopolymerizable groups, and a photopolymerization initiator, wherein the polyimide precursor includes a polyimide precursor obtained from a diamine component comprising a defined diamine compound. In other aspects, a dry film for forming a wiring-protecting film using the composition and a substrate having wiring protected by means of the dry film are provided.

Composition for forming wiring protective film and uses thereof

A photosensitive resin composition which contains (A) polyamic acid, (B) (meth)acrylate having at least two photopolymerizable C&#x2550;C unsaturated double bonds, (C) a photopolymerization initiator and (D) a flame retardant, with the (meth)acrylate (B) having at least two photopolymerizable C&#x2550;C unsaturated double bonds being contained in an amount of 10 to 700 parts by weight based on 100 parts by weight of the polyamic acid (A).

Photosensitive resin composition, dry film, and workpiece using the same

An insulating adhesive tape which comprises a base supporting film and an adhesive layer formed on at least one surface thereof, said adhesive layer being formed of a thermoplastic polymer comprising a thermoplastic polyimide, wherein said thermoplastic polymer has a glass transition temperature ranging from 180.degree. C. to 280.degree. C. and an elastic modulus ranging from 10.sup.10 dyne/cm.sup.2 to 10.sup.11 dyne/cm.sup.2 at 25.degree. C., said modulus including a value ranging from 10.sup.2 dyne/cm.sup.2 to 10.sup.9 dyne/cm.sup.2 at a temperature between 250.degree. C. and 300.degree. C.

Insulating adhesive tape, and lead frame and semiconductor device

A process for the preparation of an N-substituted unsaturated carboxylic acid amide represented by the following formula: ##STR1## wherein R.sup.1 means a hydrogen atom or methyl group Y denotes a methylene group, oxygen atom or methylimino group, m and n stand individually for an integer of 0 to 5, and m+n is an integer of 3 to 5. The process comprises reacting a specified .beta.-alkoxy-substituted carboxylate with a specified cyclic amine to form a .beta.-alkoxy-substituted carboxylic acid amide compound and then removing an alcohol from the carboxylic acid amide compound in the presence of a basic catalyst to form an unsaturated group.

Growing community of inventors

Chiba, Japan

Etsuo Ohkawado