Yamaichi Electronics Co., Ltd.

Other

Etsuji Suzuki

Akira Yonezawa

Hidehisa Yamazaki

Hiroshi Odaira

Toshio Okuno

Eiji Imamura

Sumio Nagashima

Masahiro Kodama

Kiyomu Chiyoda

A contact structure of a lead in which a contact structure having a lead and a bump made of suitable metals, respectively, can be formed easily and the bump and the lead can be soundly connected together in terms of electricity and strength. The contact structure of the lead comprises a lead formed by etching a conductive foil and a bump formed by electric casting by means of plating. The bump and the lead are formed of different metals, respectively, and the bump is connected to a surface of the lead through a conductive connecting material The lead is intimately contacted at a surface, on which the bump is disposed, with a first main surface of a holeless insulative sheet A basal portion of the bump is forcibly pierced into and extended all the way through the thickness of a material of the holeless insulative sheet and a side surface of the basal portion of the bump is fusion-adhered to an inner wall surface of the through-hole A distal portion of the bump is projected from a second main surface of the insulative sheet

Contact structure of lead

A plurality of protective resistors can be easily inserted between circuit forming elements, and opposite ends of each protective resistor can be properly press-contacted to each circuit forming element. The protective resistor can be easily replaced when broken. A resistor array board comprises a porous plate having a plurality of through-holes arranged in array and opening at opposite surfaces thereof; and a plurality of protective resistors removably loosely inserted into the through-holes, respectively. Each of the protective resistors are resiliently retained by an electrically conductive spring element, and opposite ends of each of the protective resistors are press-contacted with the circuit forming elements which are arranged in opposing relation on surfaces of the porous plates.

Resistor array board

A wiring board structure has an insulating base having at least one projection located thereon, wherein the insulating base and the at least one projection are integrally formed from a same piece of insulating material. The wiring board structure also has at least one lead located on the insulating base, wherein a part of the at least one lead covers the at least one projection to form at least one conductive bump.

Method of making conductive bump on wiring board

An interlayer connection structure in a circuit board characterized in that a local part of a conductive circuit layer disposed at one surface side of an insulative sheet is bent inwardly of the insulative sheet so that an apex of a projectingly bent portion is formed, and the apex of the projectingly bent portion is abutted with another conductive circuit layer disposed at the other surface side of the insulative sheet so that an interlayer connection is established therebetween.

Method of forming an interlayer connection structure

An IC package is provided that has a flexible wiring sheet, including an upper portion, a lower portion and a side portion which is wound around a base member over an upper surface, side surfaces and a lower surface of the base member. An IC is loaded on an upper surface of the upper flexible wiring sheet covering the upper surface of the base member. The IC is connected to an electrode provided on an upper lead pattern portion laid along the upper surface of the flexible wiring sheet. The lead pattern is extended from the upper flexible wiring sheet to the lower flexible wiring sheet via the side surfaces of the flexible wiring sheet covering side surfaces of the base member. An electrode to be connected with an object is arranged on the lower lead pattern portion which is formed on the lower flexible wiring sheet, and overall the IC or an IC connection portion is sealed on the upper surface of the upper flexible wiring sheet.

IC package having a single wiring sheet with a lead pattern disposed

A contact converting structure of a semiconductor chip comprises a semiconductor chip with a group of electrodes arranged on a surface of one side thereof. A liquid crystal polymer film is bonded to the surface in such a manner as to cover the electrodes group, and a group of external contacts is arranged on the other surface of the semiconductor chip. The external contacts group is connected to the electrodes group through the liquid crystal polymer film. A process for manufacturing a semiconductor chip having such a contact converting structure is also disclosed.

Contact converting structure of semiconductor chip and process for

A circuit board includes a wiring board which includes an insulative board having a wiring pattern on one surface thereof, a connection hole being formed in the insulative board such that the connection hole reaches the wiring pattern, a conductive bump, which is formed by growing a plating on the wiring pattern, being embedded in the connection hole, and the conductive bump serves as a connection to a wiring pattern which is intimately attached to the other surface of the insulative board.

Circuit board

A pattern position detecting apparatus has an ITV camera for receiving the image of a pattern of the IC chip and a memory for storing therein the image signal from the ITV camera as a pattern data. When the pattern data is read out from the memory, a pattern section is shifted every second picture-element array in the horizontal and vertical directions and the picture elements are picked up every second picture element from the pattern section. The pattern data corresponding to the pattern sections read out from the memory are compared with reference pattern data, whereby determination is made of the degree of coincidence between both of the patterns. After determination has been made of the degrees of coincidence with respect to the whole pattern, detection is made of the position of the pattern section having the highest degree of coincidence among said degrees of coincidence in accordance with the address of the memory.

Growing community of inventors

Kanagawa-ken, Japan

Etsuji Suzuki