The Furukawa Electric Co., Ltd.

Etsuji Katayama

Yuta Ishige

Yuichiro Irie

Jun Miyokawa

Toshio Kimura

Hajime Mori

Atsushi Oguri

Kaoru Sekiguchi

Kiyokazu Tateno

Naoki Hayamizu

Masahiro Yoshida

Takeo Shimizu

Junichi Hasegawa

Maiko Ariga

Hidehiro Taniguchi

Takeharu Yamaguchi

Noritaka Matsubara

Takeshi Namegaya

Tatsuro Kurobe

Masayoshi Nishita

Toshiaki Tsuda

Akira Mugino

Toshio Sugaya

Hideo Aoyagi

Masakazu Yoshihara

A semiconductor optical device includes: a base configured to intersect with a first direction; a first protrusion configured to protrude from the base in the first direction, the first protrusion including a planar lightwave circuit including: a core layer; and a cladding layer surrounding the core layer; a second protrusion configured to protrude from the base in the first direction and arranged along the first protrusion in a second direction intersecting with the first direction, a height of the second protrusion from the base in the first direction being lower than a height of the first protrusion; an optical semiconductor element placed on a facet of the second protrusion in the first direction and optically connected to the core layer; and a marker provided on the second protrusion in a manner exposed on the facet, the marker being made of a same material as the core layer.

Semiconductor optical device and method of manufacturing semiconductor optical device

A semiconductor laser module that can increase output of an optical fiber laser is provided. The semiconductor laser module includes: a mounted-base member having a mounted-base face; a plurality of semiconductor laser elements installed on the mounted-base face of the mounted-base member; a lens that collimates laser light emitted from the semiconductor laser element; a condensing lens that condenses the laser light; and an optical fiber to which the condensed laser light is optically coupled, and further includes: between the condensing lens that condenses the laser light and the lens that collimates laser light emitted from the semiconductor laser element, an aperture that restricts light in a slow axis direction of the laser light.

Semiconductor laser module

An optical device includes: a base having first and second ends in first and second directions, respectively, and extends in the first direction; an optical module having a head adjacent to the base and is positioned close to the second end and a neck protruding from the head and is thinner than the head; a substrate attached on the base arranged with the head; and a pressing member having a first fixing portion fixed to the base, a second fixing portion fixed to the base, a first extension portion extending from the first fixing portion, a second extension portion extending from the second fixing portion, and a pressing portion provided in at least one of the first and the second extension portions and presses the head against the base.

Optical device

A laser device that is easily assembled and can be manufactured at low cost and a light-source device using the same are provided. The laser device includes a base plate portion, a semiconductor laser element placed on the base plate portion, a lid portion provided on the base plate portion, on which the semiconductor laser element is placed, and including a top plate, and a side wall portion covering a part or all of lateral sides of a space between the base plate portion and the top plate. The top plate is integrally formed with a part or all of the side wall portion.

Laser device and light-source device

A laser device that is easily assembled and can be manufactured at a low cost and a light-source device using the same are provided. The laser device includes a mount member including a mount surface, and a semiconductor laser element placed on the mount surface of the mount member. An upper side and lateral sides of the semiconductor laser element on the mount surface are exposed.

A flexible substrate has an insulating base member and a conductive layer that is formed on the base member and includes an electrical connecting portion fixed to a component and electrically connected to the component, and the flexible substrate includes: a main portion on which the electrical connecting portion is formed; and a protruding portion provided so as to protrude from a portion of the main portion in which the electrical connecting portion is formed, wherein the main portion is bent along a first bending line extending in a first direction, and wherein the protruding portion can be bent along a second bending line extending in a second direction intersecting the first direction and is adapted to reduce stress occurring at the electrical connecting portion by the protruding portion being bent along the second bending line.

Flexible substrate, flexible substrate-attached component, and manufacturing method of flexible substrate-attached component

Provided is a laser apparatus and a light source apparatus that can reduce the footprint and realize space-saving. The laser apparatus has a bottom plate; a semiconductor laser element mounted on the bottom plate; and a terminal unit that is provided so as to face upward with respect to the bottom plate and enables external electrical connection.

Laser apparatus and light source apparatus

A drawer structure, etc. of an optical fiber from an optical module is disclosed. An optical fiber drawer structure is configured by a roughly cylindrical passage through which an optical fiber passes being connected to a housing. The passage includes a sleeve connected to an outer periphery of the housing and a lid part connected to a tip side of the sleeve. The interior of the passage (sleeve) is provided with a fixing member to fix the optical fiber to the passage. A reduced diameter part and an expanded diameter part are formed in the lid part.

Optical fiber drawer structure and optical module

Semiconductor lasers are arranged in a plurality of columns. The columns of the respective semiconductor lasers include semiconductor laser installed columns. Reflecting mirrors in the respective semiconductor laser installed columns reflect light in substantially the same axial direction as viewed from above, and constitute beam groups. The beam groups of the respective semiconductor laser installed columns are formed on both sides in a width direction of a housing. That is, the beam groups are configured for each of the semiconductor laser installed columns, and the respective beam groups are formed on mutually different axes as viewed from above.

Semiconductor laser module and semiconductor laser module manufacturing method

A semiconductor laser module includes a package; a plurality of semiconductor laser elements provided in the package; a member having a plurality of mounting surfaces on which the semiconductor laser elements are mounted, the mounting surfaces being separated from a bottom surface of the package by respective distances, the distances being gradually different from each other in a manner that the mounting surfaces as a whole form a step-like form; a plurality of lenses collimating respective laser beams emitted from the semiconductor laser elements; a plurality of reflection mirrors reflecting the respective laser beams; a condenser lens unit condensing the laser beams; an optical fiber where the optical beams condensed by the condenser lenses are optically coupled; and an optical filter disposed on optical lines of the respective laser beams reflected by the reflection mirrors and reflecting light having wavelengths different from the wavelengths of the laser beams.

A semiconductor laser module includes a semiconductor laser element outputting a laser light; an optical fiber; an optical component disposed at an outer periphery of the optical fiber and fixing the optical fiber; a first-fixing agent fastening the optical component and the optical fiber; a light-absorbing element disposed at an outer periphery of the optical component and fixing the optical component; a first light-blocking portion disposed between an end into which the laser light is incident of the optical fiber and the optical component; and a housing accommodating therein the semiconductor laser element, an end into which the laser light is incident of the optical fiber and the first light-blocking portion. The optical component has an optical transmittance at a wavelength of the laser light, and the light-absorbing element has an optical absorptivity at a wavelength of the laser light.

A method of manufacturing a semiconductor device including a semiconductor layer and a dielectric layer deposited on the semiconductor layer, including: forming the semiconductor layer; performing a surface treatment for removing a residual carbon compound, on a surface of the semiconductor layer formed; forming a dielectric film under a depositing condition corresponding to a surface state after the surface treatment, on at least a part of the surface of the semiconductor layer on which the surface treatment has been performed; and changing a crystalline state of at least a partial region of the semiconductor layer by performing a heat treatment on the semiconductor layer on which the dielectric film has been formed.

Manufacturing method of semiconductor device, semiconductor device, communication apparatus, and semiconductor laser

A semiconductor laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system including an optical fiber and a lens portion, a holder configured to receive a portion of the optical system, a base having a holder mounting member and a fastening member, and a bottom plate configured to support the base. The holder is mounted to the fastening member at a first joint position, and the fastening member is mounted to the holder mounting member at a second joint position, where the first and second joint positions are located at substantially a same distance from the bottom plate. Alternatively, the first and second joint positions are coplanar with an active layer of the diode. Alternatively, the holder is mounted to the fastening member at a plurality of first joint positions, and the fastening member being mounted to the holder mounting member at a plurality of second joint positions, where the plurality of first and second joint positions are coplanar.

Semiconductor laser diode module

A semiconductor laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system including an optical fiber and a lens portion, a base configured to support the laser diode and at least a portion of the optical system, and a bottom plate configured to support the laser diode, the optical system, and the base. The optical system is configured to receive and transmit a beam emitted from the laser diode through the lens portion to the optical fiber along an optical axis. The base includes a structural support member configured to prevent warping of the base, where the structural support member extends along the base in a direction generally parallel to the optical axis.

A laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system, an optical system mounting member supporting at least a portion of the optical system, a laser diode mounting member, and a bottom plate supporting the laser diode, the optical system, the optical system mounting member, and the laser diode mounting member. The optical system receives and transmits a beam emitted from the laser diode through a lens portion to an optical fiber. The optical system mounting member is attached to the laser diode mounting member. The laser diode module preferably includes a thermo module having a first plate member attached to the laser diode mounting member. The laser diode mounting member is preferably formed of material having an expansion coefficient in a range between an expansion coefficient of the optical system mounting member and an expansion coefficient of the first plate member.

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Tokyo, Japan

Etsuji Katayama