Sumitomo Bakelite Company Limited

Promerus, Lcc

Etsu Takeuchi

Andrew Bell

Edmund Elce

Robert A Shick

Xiaoming Wu

Ramakrishna Ravikiran

Akira Tokoh

Rajesh Raja Puthenkovilakom

Takashi Hirano

Yasunori Takahashi

Hiroaki Makabe

Dino Amoroso

Brian Bedwell

Nobuyuki Sashida

Daoji Gan

Seok Ho Kang

Larry Funderburk Rhodes

Saikumar Jayaraman

Hendra Ng

Wei Zhang

Brian F Knapp

Toshio Banba

Toshiro Takeda

Hiromichi Sugiyama

Junya Kusunoki

Naoshige Takeda

Masakazu Kawata

Shinichi Mikami

Takuya Tochimoto

Yoshiyuki Yamamori

William DiMenna

Toshio Nakao

Jianyong Jin

Toshiharu Kuboyama

To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this. A temporary bonding adhesive for a semiconductor wafer, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition whereof the 50% weight loss temperature decreases after irradiation by active energy rays.

Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same

A polymer includes a first type of repeat unit represented by Formula I: 

Directly photodefinable polymer compositions and methods thereof

Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.

Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films

Process for producing two-layered tape for tab

The present invention provides a positive photo-sensitive resin composition comprising a polybenzoxazole precursor as a base resin, an organic solvent-soluble polymer or its precursor (e.g., a polyamic acid) as a component for imparting improved adhesion, flexibility or heat resistance, and a diazoquinone compound and/or a dihydropyridine compound as a photosensitive agent. This photo-sensitive resin composition can form a pattern of high resolution and further has excellent adhesion and mechanical properties. The present invention further provides three novel diazoquinone compounds as a photo-sensitive agent, which compounds give high resolution, high contrast and thick-film formability when compounded in a positive photo-sensitive resin composition. The present invention furthermore provides a new type positive photo-sensitive resin composition obtained by reacting a polybenzoxazole precursor with a diazoquinone compound as a photo-sensitive agent. This photo-sensitive resin composition has excellent alkali resistance when unexposed to a light and accordingly can give a high residual film ratio.

Positive photo-sensitive resin composition comprising a photosensitive

The present invention provides a photosensitive resin composition which comprises as essential components: (A) a polyamic acid having a recurring unit represented by the following formula [I]: ##STR1## wherein 0.5-50 mol % of R.sub.1 consists of a silicone diamine residue represented by the following formula [II]: ##STR2## wherein n represents an integer of 1-50, and the remainder of 50-99.5 mol % of R.sub.1 consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, and a heterocyclic group, and R.sub.2 consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, a heterocyclic group, and a silicone group, and m represents 1 or 2, (B) an amide compound having carbon-carbon double bond, and (C) a photosensitizer. The present invention further provides a semiconductor apparatus in which the above composition is used.

Photosensitive resin composition and semiconductor apparatus using it

The present invention provides a photosensitive resin composition which comprises, as essential components:

Photosensitive resin composition with polyamic acid polymer

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Tokyo, Japan

Etsu Takeuchi