Mts IP Holdings Ltd

Ethan Schmitz

Richard Mark Eiland

Jimil Shah

Luke Gregory

Ioannis Manousakis

Cooling assemblies and related methods to cool a plurality of semiconductor dies mounted to a printed circuit board are described. A valved boiling enhancement enclosure located adjacent to a heat spreader that thermally couples to one or more semiconductor dies. The boiling enhancement enclosure can actively manage boiling of coolant liquid near the heat spreader in a two-phase immersion-cooling chamber to make the temperatures across the semiconductor dies more uniform.

Boiler enhancement coatings with active boiling management

Methods to form a boiling enhancement coating (BEC) directly on a protective lid or directly on a semiconductor die are described. The BEC can improve heat dissipation from the protective lid or semiconductor die into a coolant liquid of a two-phase immersion-cooling system. In some cases, a heat spreader is not needed to cool the semiconductor die.

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Saint Paul, MN, United States of America

Ethan Schmitz