Rohm and Haas Company

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Other

Ethan S Simon

Graham Swift

Yi H Paik

Michael B Freeman

Newman M Bortnick

Mary Jo Kulp

Robert E Jerman

James M Lipovsky

Andrew T Daly

Eric Gustave Lundquist

Bainian Qian

George C Jacob

Robert H Gore

Matthew Steward Gebhard

John R Mattox

Wayne Devonport

Casmir S Ilenda

Ramesh B Petigara

Michael Louis Spera

Paul Francis Reeve

Carl Michael Hesler

Darrell String

James R Lesniak

Jenifer Lyn Machleder, Legal Representative

Eric Michael Machleder, Legal Representative

The polishing pad is suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad has a polishing surface, an opening through the polishing pad and a transparent window within the opening in the polishing pad. The transparent window has a concave surface with a depth that increases with use of the polishing pad. A signal region slopes downward into the central region for facilitating debris removal and a debris drainage groove extending through the central region into the polishing pad. Rotating the polishing pad with polishing fluid in the debris drainage groove sends debris from the central region into the polishing pad through the debris drainage groove.

Polishing pad window

The polishing pad is suitable for polishing patterned semiconductor substrates containing at least one of copper, dielectric, barrier and tungsten. The polishing pad includes a polymeric matrix; and the polymeric matrix being a polyurethane reaction product of a polyol blend, a polyamine or polyamine mixture and toluene diisocyanate. The polyol blend is a mixture of 15 to 77 weight percent total polypropylene glycol and polytetramethylene ether glycol; and the mixture of polypropylene glycol and polytetramethylene ether glycol having a weight ratio of the polypropylene glycol to the polytetramethylene ether glycol from a 20 to 1 ratio to a 1 to 20 ratio. The polyamine or polyamine mixture is 8 to 50 weight percent; and the toluene diisocyanate is 15 to 35 weight percent total monomer or partially reacted toluene diisocyanate monomer.

Multi-functional polishing pad

Chemical mechanical polishing pads having a window with an integral identification feature, wherein the window has a polishing face and a nonpolishing face, wherein the integral identification feature is observable through the window, and wherein the integral identification feature identifies the chemical mechanical polishing pad as a type of chemical mechanical polishing pad selected from a plurality of types of chemical mechanical polishing pads. Also provided is a method of making such chemical mechanical polishing pads and for using them to polish a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate.

Chemical mechanical polishing pad having window with integral identification feature

A method for imparting damage resistance to a coating, film or article of manufacture comprising adding crosslinked polymeric nanoparticles having a size range of 1-100 nm in diameter to said coating, film or article of manufacture.

Damage resistant coatings, films and articles of manufacture containing crosslinked nanoparticles

A method for reducing the amount of microfoam in a spray-applied waterborne polymeric composition is provided, wherein a gas, such as, for example, carbon dioxide, having a solubility factor greater than one is used in spraying the waterborne composition. Articles so coated are also provided. And, a method for increasing the density of a spray-dried waterborne polymeric composition is provided, wherein a gas, such as, for example, carbon dioxide, having a solubility factor greater than one is used in spray-drying the waterborne composition.

Reduction of microfoam in a spray-applied waterborne composition

Stable microbicidal compositions containing a 3-isothiazolone compound, metal nitrate, bromic acid, iodic acid, periodic acid, or their salts and water are disclosed. Also disclosed are methods of preventing or reducing precipitate formation in 3-isothiazolone compositions.

Stable microbicide formulation

An ink composition and a method for preparing the ink composition are disclosed. The ink composition provides stability, bleed resistance and lightfastness without requiring the use of a cosolvent. The composition is based on a polymeric dispersant which is compatible with the hydrophobic surfaces of many pigments and which forms a stable dispersion of pigment in an aqueous environment. The ink composition is useful for organic and inorganic pigments.

Ink composition and method for preparing

A method for producing polysuccinimide is provided. Thermal polymerization of maleamic acid at a temperature of from about 160.degree. C. to about 330.degree. C. produces polysuccinimide. The reaction is optionally conducted in the presence of one or more processing aids, solvents or diluents. The polysuccinimide is particularly useful as a detergent additive.

Production of polysuccinimide by thermal polymerization of maleamic acid

A method for producing polysuccinimides is provided. A rotary tray dryer operating at an internal temperature of from about 110.degree. to about 300.degree. C. and providing a residence time of from about 1 hour to about 10 hours is used in the polycondensation of one or more amino acids, amic acids or ammonium salts of monoethylenically unsaturated dicarboxylic acids to produce polysuccinimides.

Method for preparing polysuccinimides using a rotary tray dryer

A process is provided for preparing polysuccinimides by forming a polymerization mixture of poly(alkylene glycol), aspartic acid and, optionally, one or more other amino acids; heating the mixture to an elevated temperature; and maintaining the mixture at the elevated temperature to form polysuccinimides.

Process for preparing polysuccinimides from aspartic acid

A process is provided for preparing polysuccinimides by forming a polymerization mixture of poly(alkylene glycol), maleamic acid and, optionally one or more other amic acids, heating the mixture to an elevated temperature, and maintaining the mixture at the elevated temperature to form polysuccinimides.

Process for preparing polysuccinimides from maleamic acid

A continuous process for preparing polymers is provided: The continuous process produces polymers from monoethylenically unsaturated acids or anhydrides, and a nitrogen-containing compound, optionally in the presence of a fluidizing agent. The polymers are useful as detergent additives, pigment and mineral dispersants, additives for fertilizers, and corrosion and scale inhibitors in boilers and cooling towers.

Continuous thermal polycondensation process for preparing polymers

A method for producing polysuccinimide is provided. Thermal polymerization of fumaramic acid at a temperature of from about 160.degree. C. to about 330.degree. C. produces polysuccinimide. The reaction is optionally conducted in the presence of one or more processing aids, solvents or diluents. The polysuccinimide is particularly useful as a detergent additive.

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Ambler, PA, United States of America

Ethan S Simon