Infineon Technologies Ag

Erwin Vogl

Markus Zundel

Franz Hirler

Peter Nelle

Markus Winkler

Ludger Borucki

A method for processing a semiconductor device in accordance with various embodiments may include: providing a semiconductor device having a first pad and a second pad electrically disconnected from the first pad; applying at least one electrical test potential to at least one of the first pad and the second pad; and electrically connecting the first pad and the second pad to one another after applying the at least one electrical test potential.

Semiconductor devices and processing methods

An anchoring structure for a metal structure of a semiconductor device includes an anchoring recess structure having at least one overhanging side wall, the metal structure being at least partly arranged within the anchoring recess structure.

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Hallbergmoos, Germany

Erwin Vogl