Fairchild Semiconductor Corporation

Erwin Victor Cruz

Maria Cristina B Estacio

Aira Lourdes Villamor

Geraldine Suico

Silnore Sabando

In a general aspect, a method for producing a packaged semiconductor device can include coupling a semiconductor device to a leadframe structure having a signal lead that is electrically coupled with the semiconductor device. The method can also include forming, with a laser, a groove in the signal lead, the groove having a first sidewall and a second sidewall, and applying solder plating to the signal lead, including the first sidewall and the second sidewall of the groove. The method can further include separating, at the groove, the signal lead into a first portion and a second portion, such that the second portion of the signal lead is separated from the metal leadframe structure.

Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture

In a general aspect, a method for producing a packaged semiconductor device can include coupling a semiconductor device to a leadframe structure having a signal lead that is electrically coupled with the semiconductor device. The method can also include encapsulating at least a portion of the semiconductor device and at least a portion of the leadframe structure in a molding compound. At least a segment of the signal lead can be exposed outside the molding compound. A surface of the molding compound can define a primary plane of the packaged semiconductor device. The method can further include forming, with a laser, a groove in the segment, applying solder plating to the segment, including the groove, and separating, at the groove, the segment into a first portion and a second portion, such that the second portion of the segment is separated from the leadframe structure.

In a general aspect, a packaged semiconductor device can include a semiconductor device and a metal leadframe structure having a signal lead that is electrically coupled with the semiconductor device. The device can also include a molding compound encapsulating at least a portion of the metal leadframe structure. At least a portion of the signal lead can be exposed outside the molding compound. The device can further include a solder plating disposed on exposed portions of the metal leadframe structure. In the device, a flank of the signal lead can have a surface area. At first portion of the surface area of the flank can be defined by the solder plating, and a second portion of the surface area of the flank can be defined by exposed metal of the metal leadframe structure. A perimeter of a surface of the exposed metal can have at least one curved edge.

A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.

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Koronadal, Philippines

Erwin Victor Cruz