Applied Materials, Inc.

Erwin Polar

Dmitry Lubomirsky

Qiwei Liang

Kim Ramkumar Vellore

Yeuk-Fai Edwin Mok

Brigitte C Stoehr

Danny D Wang

Mark Wiltse

Frank C Ma

A substrate processing chamber comprising a substrate support , and a wall about the substrate support , the wall having a radiation absorbing surface adapted to preferentially absorb radiation having wavelengths in the visible or infra-red spectrum.

Temperature controlled chamber

A method and apparatus for supporting and transferring a substrate in a semiconductor wafer processing system. In one aspect, a support ring having one or more substrate support members mounted thereon and defining a central opening therein for receipt of a substrate support member during processing is disclosed. In another aspect, a substrate handler blade having a plurality of substrate supports disposed thereon is provided which is adapted to support a substrate thereon and effectuate substrate transfer between the substrate handler blade and the support ring.

Method and apparatus for transferring and supporting a substrate

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San Jose, CA, United States of America

Erwin Polar