Brown, Boveri & Cie Ag

Bbc Brown, Boveri & Company, Limited

Bbc Aktiengesellschaft Brown, Boveri & Cie

Other

Erwin Klein

Arno Henke

Hans Zink

In the disclosed can-type evaporative cooling device for power semiconductor elements, the semiconductor elements (1) are stacked, in disk cell construction, alternately with cooling cans (2) to form a column having a conjoint clamping device (10). The cooling cans (2) have evaporator cavities for receiving an electrically insulating cooling liquid which evaporates when the semiconductor elements (1) are in operation. A closed coolant circuit between the cooling cans (2) and a conjoint recooler, via pipelines, results. For electrical separation of the electrically live cooling cans (2) from one another and from the recooler, electrically insulating horizontal vapor collecting lines (20) and condensate collecting lines (21) are provided to each of which are connected vertical vapor lines (7) and condensate lines (23), respectively, for the individual cooling cans (2). The condensate lines (21, 23) are each accommodated in the corresponding vapor lines (7, 20). Preferably, a cast polyamide is used as the material for the vapor collecting lines (20). Significant figure: FIG. 1

Can-type evaporative cooling device for power semiconductor elements

Cooling device for semiconductor components, including a chamber for receiving semiconductor components, boiling liquid disposed in the chamber for immersing the semiconductor components, a device connected to the chamber for supplying a cooling air to eliminate a temperature rise of the boiling liquid and to remove a maximum power loss at a normal maximum ambient temperature, a thermal energy accumulator connected to the chamber, and a device for switching off the cooling air supply device and switching on the thermal energy accumulator if the ambient temperature of the cooling air rises.

Cooling device, in which converters or rectifiers or other semiconductor

A power semiconductor component for liquid cooling, includes a semiconductor crystal disc which has at least one pn-junction and two main electrodes which are connected through thermally and electrically conducting multicontacts to thermally and electrically conducting heat sink discs. Together with a circular ceramic ring and further ring-shaped parts, the heat sink discs form a liquid-tight housing around which a cooling liquid can flow. The heat sink discs form the bottom of cooling capsules with a wall, a cover and cooling rods in the interior of the capsules, through which the coolant can flow. The cooling capsules are provided with openings for feeding in and discharging the coolant. The covers of the cooling capsule are provided with electrical connecting eyes. Two half-shells with hydraulic connecting eyes are provided as an outer insulating housing, having a multibranch canal system from holes formed in the connecting eyes of the half-shells to the cooling capsule openings.

Power semiconductor component for liquid cooling

A power semiconductor component is used for boiling cooling of a power semiconductor crystal disc having two main electrodes, and optionally one or more control electrodes. Two multicontacts are provided, each being electrically connected to a respective one of the main electrodes for thermal and mechanical relief. Two heat sinks are provided, each being in electrical and thermal contact with a respective one of the multicontacts. Connecting eyes are integral with the heat sinks for electrically connecting the main electrodes. A liquid and gas-tight housing surrounds the semiconductor crystal disc, the housing including a ceramic sleeve having a boiling liquid space formed therein and metallic covers disposed laterally on the ceramic sleeve, the connecting eyes protrude through and are connected to the metallic covers, and an insulating sleeve is molded around the housing. The insulating sleeve has at least one stub formed thereon having a hole formed therein for conducting an electrically-insulating refrigerant flow through the housing directly contacting the semiconductor disc, the metallic covers have partially circular cutouts formed therein and the ceramic sleeve has a hole formed therein for the refrigerant flow.

Power semiconductor component for boiling cooling

A power semiconductor component for boiling cooling or liquid cooling includes a semiconductor crystal disc having two main electrodes and, optionally, one or more control electrodes. The disc is built into a liquid and gas-tight housing through which an electrically insulating coolant can flow. The housing is formed substantially of a ceramic sleeve with metallic covers which are disposed on both sides and the metallic covers are directly acted upon by the coolant. Electric circuitry, especially resistors and diodes, are integrated in a circuitry module which is in force-locking thermal contact with the metallic cover of the power semiconductor component.

Power semiconductor component for cooling by boiling or liquids

Cooling device for electrical and/or electronic component elements

A cooling container for liquid-cooled semiconductor construction elements wherein pegs are located in the interior of the container in the flow path of the cooling liquid and arranged vertically to the floors of the container and connected with these floors so that they are tight in regard to their material. Preferably, these pegs have a square cross-section and with one diagonal are located transversely to the flow direction. In addition, barriers are located at half the distance of flow in the cooling container, which are diametrically opposite for the purpose of narrowing the cross-section of the flow.

Cooling container for cooling a semiconductor element

Cooling device for a liquid-cooled semiconductor power component of the type having a disc cell formed with two main contact surfaces and electrical and thermal pressure-contacting means therefor in an insulating casing, and having means for liquid cooling including cooling capsules through which liquid flows, the cooling capsules being connected by a clamping device to the two main contact surfaces of the disc cell and being selectively coupable through a liquid-conducting support bar to a plurality of semiconductor power components, including insulating screw connections for connecting union pipes and connecting pipes for the coolant to the cooling capsules with an inclusion of at least partly cold-deformable material of the insulating screw connections, the cooling capsules being connected coolant-wise in series, and including expansion bends formed at least in the connecting pipes between the cooling capsules.

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Heddesheim, Germany

Erwin Klein