Universal Instruments Corporation

Erwin F Bates

Michael D Snyder

Roy M Whiting

This pick and place device and method for arranging components on a printed circuit board utilizes a placement head having an articulated, compliant tip for facilitating proper alignment of the component lead plane on the substrate, for example, in a fine pitch component placement machine where extreme accuracy must be achieved in matching the component leads to the circuit land pattern. In general, the articulating tip is fitted within a cavity or opening in the lower end of a spindle. Compressed air may be introduced into the cavity generating an air bearing, thus causing the articulating tip to comply with the upper surface of the component, or else the weight of the tip itself can be used to create the desired compliance. A vacuum force is then created within said opening sufficient to pick-up the component once the compressed air has been turned off. Various configurations of the articulating tip and various methods of air and/or vacuum application are provided.

Articulating tip for pick and place head

A method and apparatus for feeding and orienting parts having at least one terminal depending from each body. The parts are fed with at least one terminal in sliding engagement along a guide rail. Misoriented parts are blown out of engagement with the guide rail by a fluid ejection means and recirculated for refeeding and orienting.

Feeding and orienting device

A method and apparatus for feeding and orienting parts. The parts are fed in sliding engagement along a guide step and ejected when misoriented. Misoriented parts are either blown off the guide step by an air knife or transversely displaced on the guide step by an ejector that alters their line of travel and causes them to fall off the guide step. All excess and misoriented parts are recirculated for refeeding and orienting.

A device for centering chip components attached to the tip of a pick and place spindle after selection from storage and prior to placement on a substrate. The need for precisely stored component chips is eliminated. A vacuum in the hollow spindle tip holds the component chip, while, in turn, cam-driven feet and fingers attached to the spindle housing push the component chip to a centered position on the spindle.

Centering device for automatic placement of chip components in hybrid

A pair of pivoting, spring-loaded blades positioned in the path of travel of a series of electronic components on a continuous conveyor, center the components on the conveyor; and a plurality of free-moving fingers rest on the components in order to maintain a centered condition as the components are conveyed into the taping mechanism of a component taping machine.

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Binghamton, NY, United States of America

Erwin F Bates