Siemens Aktiengesellschaft

Erwin Eibl

Heinz Schmidt

Heribert Rester

An electronic module includes two printed-circuit boards which are equipped with hybrid assemblies. The electronic module takes up only a small amount of space and, at the same time, efficiently dissipates the heat loss caused by the hybrid assemblies. The hybrid assemblies are arranged in such a manner that they can be interspersed with one another, similar to a sandwich-type construction. The interspersing provides duct-type, perpendicularly aligned interspaces between the hybrid assemblies, allowing the heat loss to be dissipated in a chimney-like fashion.

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Amberg, Germany

Erwin Eibl