Linde Aktiengesellschaft

Linde Aktiegesellschaft

Epm Handels Ag

Epm Handels Gmbh

Ernst Wandke

Hans Isler

Reinhard Strigl

Klaus W Gerstenberg

Johann Mästele

Christoph Laumen

Pang Ling Hiew

Boon Ann Tan

The invention relates to a device and method for selective soldering, including at least one nozzle and a soldering channel surrounded by a vertically moveable hood, which immerses in a soldering bath or which is sealed against a surface of the soldering bath. The hood includes a passage for each nozzle, at least one gas feeding device for providing protective and/or active gas underneath the hood, and flow plates which are attached to the hood to extend substantially downward in the direction of the soldering bath from the hood.

Device and method for selective soldering

The instant invention relates to a device for wave soldering workpieces, encompassing means for moving the workpiece, which is to be soldered, along a specific path across at least one solder wave generated above a solder reservoir, with a protective and/or active gas atmosphere of a first composition being located above the solder reservoir so as to exclude oxygen and with means for introducing the protective and/or active gas as well as an enclosure being provided, with the enclosure being configured in such a manner that it encloses at least the essential parts of a solder zone.

Device and method for wave soldering

A cleaning apparatus includes (1) a pressure tank with at least one cleaning tank arranged therein; (2) means for supplying the cleaning apparatus with a cleaning fluid; and (3) means inside the pressure tank for setting the at least one cleaning tank in motion, wherein by these means the at least one cleaning tank is movably arranged relative to the pressure tank in terms of at least one of rotational or translational movement.

Cleaning device and method for cleaning, using liquid and/or supercritical gases

A method is available for wave-soldering component groups, especially printed circuit boards with shielding from the environment, in which lead-free or at least low-lead solders, especially tin solders, with a melting point of more than 210.degree. C., are used. Since in wave soldering the solder bath temperature must usually be set considerably higher than the melting point of the solder, problems with overheating the components are encountered with higher-melting lead-free or low-lead solders. This problem is solved in accordance with the invention by setting a solder bath temperature which is only a few degrees Celsius above the melting point of the solder material, and performing the wave-soldering by the action of a plasma of a process gas atmosphere at low pressure.

Method for wave soldering with lead-free solder materials

Method for soldering printed-circuit boards under low pressure

Growing community of inventors

Geretsried, Germany

Ernst Wandke