Siemens Aktiengesellschaft

Ernst-Friedrich Lechner

Otto Meusel

Richard Dotzer

Meinhardt Muller

The invention relates to circuit boards consisting of a flat core plate, 1 to 5 mm thick, of metallic material, graphite or electrically conductive carbon with a coating, 10 to 80 .mu.m thick, of electroplated aluminum eloxal and, optionally, an intermediate layer of copper or silver, 0.1 to 2 .mu.m thick. On the electroplated Al eloxal layer, a conductor run structure generated by an additive or subtractive technique may be present. The highly heat-conducting and mechanically strong circuit boards find application in electronics.

Heat-removing circuit boards

A contact spring contained in a conforming recess in a guide channel has a U-shaped portion with projecting side tabs embracing the edge of a circuit board. The side tabs rest against conductors on the circuit board which carry circuit board potentials and establish a good electrical connection between the conductors and the contact spring. The contact spring also grips the circuit board. A spring leg on the contact strip goes through an opening in the guide channel and engages the subassembly carrier.

Contact spring for low resistance connection of a circuit board to a

A mounting structure for boards that can be equipped with electronic devices has structurally identical, adjacent frames, which are linked to each other on right angle lugs and can be flipped open like the pages of a book.

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Erlangen, Germany

Ernst-Friedrich Lechner