Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

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Wacker Siltronic Gesellschaft F{dot Over (u)}r Halbleitermaterialien Ag

Ernst Feuchtinger

Georg Pietsch

Guido Wenski

Gerhard Heier

Thomas Altmann

Wolfgang Winkler

Willibald Bernwinkler

Bernd Sauter

A semiconductor wafer has a front surface and a back surface and flatness values based on partial areas of a surface grid on the front surface of the semiconductor wafer, which has a maximum local flatness value SFQR of less than or equal to 0.13 &mgr;m and individual SFQR values which in a peripheral area of the semiconductor wafer do not differ significantly from those in a central area of the semiconductor wafer. There is also a process for producing this semiconductor wafer, wherein the starting thickness of the semiconductor wafer is 20 to 200 &mgr;m greater than the thickness of the carrier and the semiconductor wafer is polished until the end thickness of the semiconductor wafer is 2 to 20 &mgr;m greater than the thickness of the carrier.

Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer

A method for manufacturing a semiconductor wafer which is coated on one s and provided with a finish has a) the semiconductor wafer being subjected to a first treatment (double-sided finish) which produces a finish on both sides of the semiconductor wafer at the same time; has b) at least one coating being produced on one side of the semiconductor wafer; and has c) the semiconductor wafer being subjected to a second treatment which produces a double-sided finish.

Method for manufacturing a semiconductor wafer which is coated on one

A means for removing a semiconductor wafer from a flat substrate uses a device for removing a semiconductor wafer from a polishing cloth of a double side polishing machine. The method has a liquid being pressed through the substrate against the semiconductor wafer lying on the substrate, such that the semiconductor wafer is lifted up from the substrate by the action of the liquid. Then the wafer is picked up by a pick-up device.

Method and device for removing a semiconductor wafer from a flat

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Wittibreut, Germany

Ernst Feuchtinger